Camtek Ltd. announced that it has received a new order for 28 systems from a tier-1 manufacturer, for the inspection & metrology of High Bandwidth Memory (HBM) and Heterogenous Integration (HI) applications. This order adds to the already strong backlog of systems that are expected to be delivered during 2024. HBM is a critical component in chips enabling high-speed data processing in applications ranging from artificial intelligence and gaming to data centers.

HBM is a new technology which can lead to higher overall chip performance, energy efficiency and reduced footprint, by enabling the integration of various components such as processors, memory and sensors, all into a single package. Camtek's inspection and metrology systems play a pivotal role in ensuring the quality, reliability and performance of the chip leveraging today's newest chip fabrication technologies.