Shinko Electric Industries : (Digest) FY 2023 First-Half Financial Results
October 24, 2023
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October 26, 2023
SHINKO ELECTRIC INDUSTRIES CO., LTD.
FY2023 First-Half Financial Results
from April 1, 2023 to September 30, 2023
1.Consolidated Financial Highlights
Yen
(millions)
Six months ended September 30
FY2023
FY2022
Net sales
105,109
157,005
Operating profit
11,470
50,952
Ordinary profit
14,073
54,649
Profit attributable to owners of parent
9,780
37,873
Earnings per share (Yen)
72.39
280.34
Cash dividends per share (Yen)
25.00
25.00
Total assets
389,575
376,092
Net assets
258,541
237,545
Shareholders' equity to total
66.4%
63.2%
Net sales by business segment
Plastic Packages
65,406
95,604
Metal Packages
35,406
55,793
Others
4,296
5,607
Total
105,109
157,005
Ordinary profit by business segment
Plastic Packages
7,148
34,285
Metal Packages
7,974
20,199
Others/Adjustment
(1,049)
164
Total
14,073
54,649
2.Consolidated Earnings Forecast for FY2023
Yen
(millions)
FY2023
(Year ended
March 31, 2024)
Net sales
230,000
Operating profit
35,000
Ordinary profit
35,000
Profit attributable to owners of parent
24,000
Earnings per share (Yen)
177.63
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Shinko Electric Industries Co. Ltd. published this content on 25 October 2023 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 22 November 2023 09:19:02 UTC.
Shinko Electric Industries Co Ltd is a Japan-based company mainly engaged in the development, manufacture and sale of products based on semiconductor mounting technology. The Company is engaged in the development, manufacture and sale of semiconductor packages such as lead frames, plastic laminate packages (PLPs) and glass terminals, as well as the assembly and sale of integrated circuits (ICs). The Company is also engaged in the manufacture of a variety of semiconductor packages through an integrated production system from development and design to shipment. The Company operates through two business segments. The Plastic Package segment assembles PLPs and ICs. The Metal Package segment manufactures and sells semiconductor lead frames, semiconductor glass-to-metal seals, heat spreaders and ceramic electrostatic chucks, among others.