Veeco Instruments
Q1 2024 Financial Results
Conference Call
May 7th, 2024
1 Q1 2024 Financial Results Conference Call
Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.
Safe Harbor
This presentation contains "forward-looking statements", within the meaning of the safe harbor provisions of the U.S. Private Securities Litigation Reform Act of 1995, as amended, that are based on management's expectations, estimates, projections and assumptions. Words such as "expects," "anticipates," "plans," "believes," "scheduled," "estimates" and variations of these words and similar
expressions are intended to identify forward-looking statements. Forward-looking statements include, but are not limited to, those
regarding anticipated growth and trends in our businesses and markets, industry outlooks and demand drivers, our investment and growth strategies, our development of new products and technologies, our business outlook for current and future periods, our ongoing transformation initiative and the effects thereof on our operations and financial results; and other statements that are not historical facts. These statements and their underlying assumptions are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those expressed or implied by such statements include, without limitation:
global trade issues, including the ongoing trade disputes between the U.S. and China, and changes in trade and export license policies; the
level of demand for our products; global economic and industry conditions; global conflicts; our dependency on third-party suppliers and outsourcing partners; the timing of customer orders; our ability to develop, deliver and support new products and technologies; our ability to expand our current markets, increase market share and develop new markets; the concentrated nature of our customer base; cybersecurity attacks and our ability to safeguard sensitive information and protect our intellectual property rights in key technologies; the effects of regional or global health epidemics; our ability to achieve the objectives of operational and strategic initiatives and attract, motivate and retain key employees; the variability of results among products and end-markets, and our ability to accurately forecast future
results, market conditions, and customer requirements; the impact of our indebtedness, including our convertible senior notes and our
capped call transactions; and other risks and uncertainties described in our SEC filings on Forms 10-K,10-Q and 8-K, and from time-to- time in our other SEC reports. All forward-looking statements speak only to management's expectations, estimates, projections and assumptions as of the date of this presentation. The Company does not undertake any obligation to update or publicly revise any forward- looking statements to reflect events, circumstances or changes in expectations after the date of this presentation.
2 Q1 2024 Financial Results Conference Call
Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.
CEO Overview
Bill Miller, Ph.D.
3 Q1 2024 Financial Results Conference Call
Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.
Q1 Financial Highlights
Revenue$174M
Non-GAAP$29M Operating Income
Diluted0.45¢ Non-GAAP EPS
- Solid top and bottom-line results
- Revenue above mid-point of guide
- EPS near high-end of guide
- Record Semiconductor revenue for 2nd consecutive quarter
- Demand for LSA systems remains strong
- Multi-SystemLaser Annealing order for 2nm Gate-All-Around
- Including 1st Nanosecond Annealing order
Record Semiconductor revenue driven by strong Laser Annealing system demand
4 Q1 2024 Financial Results Conference Call
Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.
Investment Strategy Enabling SAM Expansion
Technologies
Driving Growth
TODAY
SAM Expansion
Driving FUTURE
Growth
Evaluation Program
Anchors Growth
Strategy
Future
- LSA gaining share in advanced logic due to performance benefits
- EUV Mask Blank Business well-positioned for High NA adoption
- Strength in Wet processing driven by High-Bandwidth Memory
- Laser Annealing SAM to grow above 1.0B from $600M
- LSA penetrating new memory customers
- Nanosecond Annealing for 3D devices, backside power, & material modification in logic & memory
- IBD for Front End Semi growing from $0 to $350M
- Low resistance metals applications in memory & logic
- Compound Semi opportunities in Power Electronics and Photonics
- NSA & IBD programs progressing well
- Targeting LSA shipment to 2nd leading Memory customer in late 2024
- Compound Semi program advancing
5 Q1 2024 Financial Results Conference Call
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LSA - Laser Spike Annealing | IBD - Ion Beam Deposition |
NSA - Nanosecond Annealing | SAM - Served Available Market |
EUV - Extreme Ultraviolet |
Nanosecond Annealing Opportunity
Temperature (°C)
2000
1000
100
NSA | Future | |
(nanosecond) | ||
LSA | Traditional | |
Lamp Based | ||
(sub millisecond) | (sub second) | |
Time
• Device scaling challenges driving the need for new annealing |
capabilities |
• NSA broadening Laser Annealing adoption to new Logic and |
Memory applications |
• Shallow anneal enabling backside power delivery and 3D |
devices |
• Material Modification steps to improve performance by |
changing device structure and properties |
Illustration of Wafer Cross Section
• Potential for initial logic HVM orders in 2025 & strong pull from |
Heating Depth
Very
shallow
Heats full
wafer
NSA
10nm-100nm
LSA
~100 μm
Traditional
Lamp based
Full wafer
memory customers |
Nanosecond Annealing to enable a broad range of advanced logic and memory applications
HVM - High Volume Manufacturing | NSA - Nanosecond Annealing | |
6 | Q1 2024 Financial Results Conference Call | LSA - Laser Spike Annealing |
Copyright © 2024 Veeco Instruments Inc. All Rights Reserved. |
IBD300- 300mm Front End Semi Opportunity
Illustration of grain size and distribution
TODAY
Incumbent Technology
Non-uniform, randomly oriented grains of small size = higher resistivity
FUTURE
IBD | • Industry leader in Ion Beam Technology |
• Lower resistance metals essential for improved device | |
performance & customer scaling | |
• IBD achieving superior thin film properties vs incumbent | |
technologies, including lower resistivity | |
• Ideal for advanced applications where low resistance is | |
critical | |
• Potential for initial memory HVM orders in 2025 |
Uniformly oriented large grains = lowest resistivity
IBD achieving superior thin film properties versus incumbent technologies for advanced applications
7 | Q1 2024 Financial Results Conference Call | IBD - Ion Beam Deposition |
Copyright © 2024 Veeco Instruments Inc. All Rights Reserved. |
Veeco Growth Technologies for Artificial Intelligence
CPU/GPU
Current PTOR
- Laser-SpikeAnnealing (LSA)
- IBD for EUV mask blanks
Additional Future Opportunities
- Nanosecond Annealing (NSA)
- IBD300 for low resistivity metals
CPU /
Illustration of typical AI chip
8 Q1 2024 Financial Results Conference Call
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High-Bandwidth Memory (HBM) DRAM
Current PTOR
- Laser-SpikeAnnealing (LSA)
Additional Future Opportunities
- Nanosecond Annealing (NSA)
- IBD300 for low resistivity metals
PTOR - Production Tool of Record
TSV - Through Silicon Via
GPU - Graphics Processing Unit
EUV - Extreme Ultraviolet
IBD - Ion Beam Deposition
CFO Financial Review
John Kiernan
9 Q1 2024 Financial Results Conference Call
Copyright © 2024 Veeco Instruments Inc. All Rights Reserved.
Q1 Revenue by Market & Region
Revenue by Market | Revenue by Region |
Compound
Semiconductor
12% | Data Storage | ||||||
10% | |||||||
Semiconductor | 69% | $174M | 9% | Scientific & | |||
Other | |||||||
ROW is negligible | |||||||
Revenue Trend ($M) | Q1 23 | Q4 23 | Q1 24 | ||||
Semiconductor | 93 | 115 | 120 | ||||
Compound Semi | 21 | 16 | 21 | ||||
Data Storage | 22 | 19 | 18 | ||||
Scientific & Other | 18 | 23 | 15 | ||||
Total | 154 | 174 | 174 |
APAC | China |
42% | |
37% | |
United
States
5% 16% EMEA
10 | Q1 2024 Financial Results Conference Call | |
Copyright © 2024 Veeco Instruments Inc. All Rights Reserved. | Amounts may not calculate precisely due to rounding. | |
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Veeco Instruments Inc. published this content on 07 May 2024 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 07 May 2024 20:47:56 UTC.