Amtech Systems, Inc. Stock

Equities

ASYS

US0323325045

Semiconductor Equipment & Testing

Delayed Nasdaq 01:50:06 2024-04-18 pm EDT 5-day change 1st Jan Change
4.87 USD +2.53% Intraday chart for Amtech Systems, Inc. -1.81% +15.95%
Sales 2024 * 104M Sales 2025 * 120M Capitalization 67.41M
Net income 2024 * -11M Net income 2025 * 2M EV / Sales 2024 * 0.65 x
Net cash position 2024 * - Net cash position 2025 * - EV / Sales 2025 * 0.56 x
P/E ratio 2024 *
-5.72 x
P/E ratio 2025 *
23.8 x
Employees 405
Yield 2024 *
-
Yield 2025 *
-
Free-Float 95.36%
More Fundamentals * Assessed data
Dynamic Chart
1 day+1.58%
1 week-3.63%
Current month-11.65%
1 month+0.84%
3 months+13.00%
6 months-40.25%
Current year+13.81%
More quotes
1 week
4.75
Extreme 4.75
5.01
1 month
4.65
Extreme 4.65
5.59
Current year
3.37
Extreme 3.37
5.59
1 year
3.37
Extreme 3.37
11.98
3 years
3.37
Extreme 3.37
15.78
5 years
3.37
Extreme 3.37
15.78
10 years
3.37
Extreme 3.37
15.78
More quotes
Managers TitleAgeSince
Chief Executive Officer 60 21-08-11
Director of Finance/CFO 49 16-08-31
Chief Operating Officer 68 22-08-31
Members of the board TitleAgeSince
Director/Board Member 71 07-02-18
Chief Executive Officer 60 21-08-11
Director/Board Member 57 16-01-14
More insiders
Date Price Change Volume
24-04-18 4.87 +2.53% 6 116
24-04-17 4.75 -1.86% 16,932
24-04-16 4.84 +0.83% 35,194
24-04-15 4.8 +1.05% 21,250
24-04-12 4.75 -4.23% 36,005

Delayed Quote Nasdaq, April 18, 2024 at 10:22 am EDT

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Amtech Systems, Inc. is a manufacturer of thermal processing, wafer cleaning and chemical mechanical polishing (CMP) capital equipment and related consumables used in semiconductor, advanced mobility and renewable energy manufacturing applications. The Company's segments include semiconductor, and material and substrate. The semiconductor segment is engaged in the supply of thermal processing equipment, including solder reflow ovens, horizontal diffusion furnaces, and custom high-temp belt furnaces for use by semiconductor, electronics and electro/mechanical assembly manufacturers. The material and substrate segment is engaged in the production of wafer cleaning equipment as well as substrate consumables and chemicals for lapping (fine abrading) and polishing of materials, such as silicon wafers for semiconductor products, sapphire wafers for light-emitting diode (LED) applications, and compound substrates, like silicon carbide (SiC) wafers, for power device applications.
More about the company
Trading Rating
Investor Rating
ESG Refinitiv
D+
More Ratings
Sell
Consensus
Buy
Mean consensus
OUTPERFORM
Number of Analysts
2
Last Close Price
4.75 USD
Average target price
6 USD
Spread / Average Target
+26.32%
Consensus