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MarketScreener Homepage  >  Equities  >  NASDAQ OMX STOCKHOLM  >  Assa Abloy    ASSA B   SE0007100581

ASSA ABLOY

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Patent Issued for Card Substrate Warpage Reduction (USPTO 10,363,725): Assa Abloy AB

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08/14/2019 | 04:58pm EDT

2019 AUG 14 (NewsRx) -- By a News Reporter-Staff News Editor at Engineering Business Daily -- From Alexandria, Virginia, NewsRx journalists report that a patent by the inventors Hoffman, Ted M. (Eden Prairie, MN); Lien, Brent D. (Minneapolis, MN), filed on July 22, 2014, was published online on August 12, 2019.

The patent’s assignee for patent number 10,363,725 is Assa Abloy AB (Stockholm, Sweden).

News editors obtained the following quote from the background information supplied by the inventors: “Credentials include identification cards, driver’s licenses, passports, and other documents. Such credentials are formed from credential or card substrates including paper substrates, plastic substrates, cards and other materials. Such credentials generally include printed information, such as a photo, account numbers, identification numbers, and other personal information. Credentials can also include data that is encoded in a smartcard chip, a magnetic stripe, or a barcode, for example.

“Credential production devices process credential substrates by performing at least one processing step in forming a final credential product. One such process is a transfer or lamination process that transfers a material to a surface of the card substrate using a heated transfer roller of a transfer unit of the device. This process can be used to transfer an image to the surface of the card substrate and/or provide protection to the surface of the card substrate from abrasion and environmental conditions, for example.

“Intermediate transfer films or transfer ribbons include a fracturable laminate or transfer layer, which is often referred to as a ‘thin film laminate,’ that can be transferred to a surface of a card substrate using the heated transfer roller. Such transfer layers are generally continuous resinous materials that have been coated onto a continuous carrier layer or backing to form a transfer ribbon. The side of the resin material that is not attached to the continuous carrier layer is generally coated with a thermal adhesive which is used to create a bond between the resin and the surface of the substrate. The transfer roller is used to thermally activate the adhesive and press the resinous material against the surface of the substrate to bond the material to the surface. The carrier layer or backing is removed to complete the lamination process.

“The transfer layer may also be in the form of a print intermediate, on which an image may be printed in a reverse-image printing process. In the reverse-image printing process, a print head is registered with a transfer section of the transfer layer, and an image is printed to the transfer section using the print head. Next, the imaged transfer section is registered with the card substrate and/or the transfer roller. The transfer roller is then used to activate the adhesive of the imaged transfer section causing the imaged transfer section to bond to the surface of the card substrate. The carrier layer or backing of the overlaminate material is then removed from the bonded imaged transfer section to complete the transfer of the image to the card substrate.

“The transference of the transfer layer to the surface of a card substrate generally causes the card substrate to bend such that the surface that received the transfer layer becomes concave. This is generally due to the contraction of the surface and/or the transfer layer in response to cooling. One technique for handling such warpage of the card substrate, is to pass the substrate through a device that bends the card in a manner that overcomes the warpage, such as by temporarily forcing the surface of the substrate that received the transfer layer into a convex shape.”

As a supplement to the background information on this patent, NewsRx correspondents also obtained the inventors’ summary information for this patent: “Embodiments of the invention are directed to a transfer lamination process and apparatus that reduces substrate warpage. In some embodiments, the transfer lamination process is performed using a transfer lamination device, which includes a transfer unit, a substrate rotator, and a transfer ribbon having a carrier layer and a transfer layer attached to the carrier layer. In some embodiments of the transfer lamination process, a transfer section of the transfer layer is transferred from the carrier layer to a first surface of a substrate using the transfer unit. In some embodiments of this transferring step, the transfer section is heated and pressed against the first surface of the substrate using the transfer unit, and the carrier layer is detached from the transfer section. The substrate is then inverted using the substrate rotator. At least a portion of a second surface of the substrate that is opposite the first surface is then heated using the transfer unit without transferring the transfer layer to the portion of the second surface.

“In some embodiments, the heating of at least a portion of the second surface of the substrate includes heating with the transfer unit at least the portion of the second surface of the substrate through at least a portion of the carrier layer. In some embodiments, the process includes removing a portion of the transfer layer from a portion of the carrier layer using the transfer unit before heating at least a portion of the second portion of the substrate. In some embodiments, the transfer section includes the portion of the transfer layer.

“In some embodiments of the transfer lamination process, the transfer layer is divided into a plurality of transfer panels, wherein each of a plurality of gaps in the transfer layer separates a pair of adjacent transfer panels. In some embodiments, the process step of heating at least a portion of the second surface of the substrate comprises heating with the transfer unit the portion of the second surface of the substrate through the carrier layer and one of the gaps in the transfer layer. In some embodiments, each transfer panel is separated from an adjacent transfer panel along a longitudinal axis of the carrier layer by one of the gaps. In some embodiments, the heating of the portion of the second surface of the substrate through the carrier layer and one of the gaps in the transfer layer comprises aligning one of the gaps in the transfer layer with the portion of the second surface of the substrate in the transfer unit.

“In some embodiments of the transfer lamination process, an image is printed to a surface of the transfer section before transferring the transfer section.

“In some embodiments, the transfer unit includes a heated transfer roller, and heating at least a portion of a second surface of the substrate comprises heating at least a portion of the second surface of the substrate using the heated transfer roller.

“In some embodiments, the transfer of the transfer section comprises feeding the substrate along a processing path using a transport mechanism of the transfer lamination device. In some embodiments, the rotation of the substrate using the substrate rotator comprises feeding the substrate from the transfer unit to the substrate rotator using the transport mechanism. In some embodiments, the heating of at least a portion of the second surface of the substrate comprises feeding the substrate from the substrate rotator to the transfer unit using the transport mechanism.

“This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter. The claimed subject matter is not limited to implementations that solve any or all disadvantages noted in the Background.”

The claims supplied by the inventors are:

“What is claimed is:

“1. A transfer lamination process using a transfer lamination device, which includes a transfer unit, a substrate rotator, and a transfer ribbon that includes a carrier layer and a transfer layer attached to the carrier layer, the transfer lamination process comprising: transferring a transfer section of the transfer layer from the carrier layer to a first surface of a substrate using the transfer unit including: heating the transfer section and pressing the transfer section against the first surface of the substrate using the transfer unit; and detaching the carrier layer from the transfer section; inverting the substrate using the substrate rotator; and heating at least a portion of a second surface of the substrate that is opposite the first surface using the transfer unit without transferring the transfer layer to the portion of the second surface; wherein: the transfer unit includes a heated transfer roller; and heating the portion of the second surface of the substrate comprises heating the portion of the second surface of the substrate using the heated transfer roller.

“2. The transfer lamination process according to claim 1, wherein heating at least a portion of a second surface of the substrate comprises heating with the heated transfer roller at least the portion of the second surface of the substrate through at least a portion of the carrier layer.

“3. The transfer lamination process according to claim 2, further comprising removing a portion of the transfer layer from the transfer layer that is attached to the carrier layer and the portion of the carrier layer using the transfer unit before heating at least a portion of a second surface of the substrate.

“4. The transfer lamination process according to claim 3, wherein the transfer section includes the portion of the transfer layer.

“5. The transfer lamination process according to claim 1, wherein: the transfer layer is divided into a plurality of transfer panels, wherein each of a plurality of gaps in the transfer layer separates a pair of adjacent transfer panels; and heating at least a portion of a second surface of the substrate comprises heating with the transfer unit the portion of the second surface of the substrate through the carrier layer and one of the gaps in the transfer layer.

“6. The transfer lamination process according to claim 5, wherein each transfer panel is separated from an adjacent transfer panel along a longitudinal axis of the carrier layer by one of the gaps.

“7. The transfer lamination process according to claim 5, wherein heating with the transfer unit the portion of the second surface of the substrate through the carrier layer and one of the gaps in the transfer layer comprises aligning one of the gaps in the transfer layer with the portion of the second surface of the substrate and the transfer unit.

“8. The transfer lamination process according to claim 2, wherein heating at least a portion of a second surface of the substrate comprises heating with the transfer unit at a temperature below the activation temperature of the transfer layer.

“9. The transfer lamination process according to claim 1, further comprising printing an image to a surface of the transfer section before transferring a transfer section.

“10. The transfer lamination process according to claim 1, wherein: transferring a transfer section comprises feeding the substrate along a processing path using a transport mechanism of the transfer lamination device; rotating the substrate using the substrate rotator comprises feeding the substrate from the transfer unit to the substrate rotator using the transport mechanism; and heating at least a portion of a second surface of the substrate comprises feeding the substrate from the substrate rotator to the transfer unit using the transport mechanism.

“11. The transfer lamination process according to claim 10, wherein the substrate comprises a card substrate.

“12. A transfer lamination process using a transfer lamination device, which includes a transfer unit, a substrate rotator, and a transfer ribbon, the transfer ribbon includes a carrier layer and a transfer layer attached to the carrier layer, the transfer layer is divided into a plurality of transfer panels, and each of a plurality of gaps in the transfer layer separates a pair of adjacent transfer panels, the transfer lamination process comprising: transferring a transfer section of the transfer layer of one of the transfer panels from the carrier layer to a first surface of a substrate using the transfer unit including: heating the transfer section and pressing the transfer section against the first surface of the substrate using a heated transfer roller of the transfer unit; and detaching the carrier layer from the transfer section; inverting the substrate using the substrate rotator; and heating the second surface of the substrate that is opposite the first surface through the carrier layer and one of the gaps in the transfer layer using the heated transfer roller of the transfer unit.

“13. The transfer lamination process according to claim 12, further comprising printing an image to a surface of the transfer section before transferring a transfer section.

“14. A transfer ribbon for use in a transfer lamination process comprising: a carrier layer; and a plurality of transfer panels each comprising a fracturable transfer layer attached to the carrier layer; wherein each of a plurality of gaps in the transfer layer separates a pair of adjacent transfer panels along a longitudinal axis of the carrier layer.

“15. The transfer ribbon according to claim 14, wherein the fracturable transfer layer of each transfer section is configured to fracture during a transfer lamination operation on a substrate between a transfer section of the transfer layer that is bonded to the substrate, and a portion of the transfer layer that adjoins the transfer section and remains adhered to the carrier layer after the carrier layer is detached from the transfer section.

“16. The transfer lamination processes according to claim 1, wherein heating the transfer section and pressing the transfer section against the first surface of the substrate comprises heating the transfer section and pressing the transfer section against the first surface of the substrate using the heated transfer roller of the transfer unit.

“17. The transfer lamination processes according to claim 16, wherein: a portion of the transfer layer adjoins the transfer section on the carrier layer during heating the transfer section and pressing the transfer section against the first surface of the substrate; and the portion of the transfer layer remains adhered to the carrier layer after detaching the carrier layer from the transfer section.

“18. The transfer lamination process according to claim 1, wherein heating the portion of the second surface of the substrate using the heated transfer roller includes: feeding the substrate in a feed direction; and pressing the heated transfer roller against the second surface over an entire length of the substrate, which is oriented in the feed direction.

“19. The transfer lamination processes according to claim 12, wherein: a portion of the transfer layer adjoins the transfer section on the carrier layer during heating the transfer section and pressing the transfer section against the first surface of the substrate; and the portion of the transfer layer remains adhered to the carrier layer after detaching the carrier layer from the transfer section.”

For additional information on this patent, see: Hoffman, Ted M.; Lien, Brent D. Card Substrate Warpage Reduction. U.S. Patent Number 10,363,725, filed July 22, 2014, and published online on August 12, 2019. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=10,363,725.PN.&OS=PN/10,363,725RS=PN/10,363,725

(Our reports deliver fact-based news of research and discoveries from around the world.)

Copyright © 2019 NewsRx LLC, Engineering Business Daily, source Science Newsletters

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Financials (SEK)
Sales 2019 93 600 M
EBIT 2019 15 108 M
Net income 2019 10 943 M
Debt 2019 27 098 M
Yield 2019 1,79%
P/E ratio 2019 22,0x
P/E ratio 2020 20,9x
EV / Sales2019 2,84x
EV / Sales2020 2,61x
Capitalization 239 B
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Mean consensus HOLD
Number of Analysts 20
Average target price 202,00  SEK
Last Close Price 215,20  SEK
Spread / Highest target 15,7%
Spread / Average Target -6,13%
Spread / Lowest Target -30,3%
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Nico Delvaux President & Chief Executive Officer
Lars Sture Renström Chairman
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