CyberOptics : Preview of Semicon Taiwan 2019

Demonstrating AVLS3 and NanoResolution MRS Sensor

Taipei Nangang Exhibition Center - September 18 to 20, 2019 - Booth #L0310

New Auto Vibration and Leveling Sensor (AVLS3)

At only 3.5mm, AVLS3 can travel with ease to most fab locations where a wafer travels. The Chemically Hardened Glass (CHG) substrate enables smooth wafer handling and improved vacuum chucking.

With long-range wireless capability, AVLS3 combined with new, easy-to-use CyberSpectrum software, collects and displays both leveling and vibration data simultaneously for fast equipment set-up, alignment and real-time equipment diagnostics.

New NanoResolution MRS Sensor

Additionally, for wafer-level and advanced packaging inspection and measurement, CyberOptics will demonstrate the new proprietary NanoResolution MRS sensor technology that meticulously identifies and rejects multiple reflections caused by shiny components and mirror-like surfaces. Effective suppression of multiple reflections is critical for highly accurate measurements.

Technical Paper Presentation

Taipei Nangang Exhibition Center on September 17 at 12:10pm.

Tim Skunes, VP of R&D at CyberOptics

Tim Skunes, VP of R&D at CyberOptics, will present the technical paper 'High Precision Sensing Technology for Semiconductor Inspection and Measurement Applications.' The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels for higher bandwidth and lower power consumption. In addition to the increased complexity, shiny and mirror-like surfaces present inspection challenges.

For wafer-level and advanced packaging inspection and measurement, CyberOptics will demonstrate the new proprietary NanoResolution Multi-Reflection Suppression (MRS) sensor technology that meticulously identifies and rejects multiple reflections caused by shiny components and mirror-like features. Effective suppression of multiple reflections is critical for highly accurate measurements.

Offering an unparalleled combination of high accuracy, high resolution and speed, MRS sensors are widely used for inspection and measurement in the SMT, semiconductor and metrology markets. The new 3-micron NanoResolution (X/Y resolution of 3 micron, Z resolution of 50 nanometer) MRS sensor enables metrology grade accuracy with superior 100% 3D and 2D measurement performance for features as small as 25-micron.

Further, it is two to three times faster than alternate solutions in the marketplace. With data processing speeds in excess of 75 million 3D points per second, the NanoResolution MRS sensor delivers throughput greater than 25 wafers (300mm) per hour. 100% 3D and 2D metrology and inspection can be completed simultaneously at high speed, versus an alternate, slow method that requires two separate scans for 2D and 3D, and only a sampling of a few dies of the 25 wafers.

This best-in-class MRS sensor technology is ideally suited for the inspection of solder balls and bumps, copper pillars, and other wafer-level and advanced packaging applications where high precision and speed are needed to improve yields, throughput and process control.

CyberOptics Corporation
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