After the recent acquisitions of two exhibitions in China and one in Brazil, which have helped to strengthen the Group's exhibition portfolio, Fiera Milano continues to implement its internationalization strategy through the export of successful exhibition models outside the national borders.

And it does so with the creation of E-PACK TECH, the new event dedicated to technologies and packaging materials for e-commerce, in partnership with Ipack Ima Srl.

The event is organized by Fiera Milano through Hannover Milano Fairs Shanghai, a Chinese joint venture with Deutsche Messe AG, and that will take place in Shanghai in October 2019 within CeMAT Asia, a reference event for China dedicated to internal handling , technological automation, transport and logistics systems.

With this transaction, Fiera Milano, supported by Ipack Ima, intends to consolidate the Italian leadership in one of the strategic sectors for the Italian industry. The implementation of E-PACK TECH, in fact, is placed in a strengthening perspective of the production sectors overseen by the Group, such as the instrumental mechanics for the packaging industry. Thanks to this new event, Italian and European excellence will immediately have direct contact with the Chinese market, starting up business meetings in the local market.

With a turnover of € 7.2 billion in 2017 (source: Ucima), the industry of Italian manufacturers of automatic packaging machines is one of the fastest growing Italian industrial sectors and China is the 5th target market for the export of Italian companies that produce packaging technologies. In the packaging industry - in particular - the impact of e-commerce has been significant: four out of ten companies manufacturing this type of machinery have received specific requests for the on-line trade channel (source: Osservatorio 2018 NETCOMM - IPACKIMA ).

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Fiera Milano S.p.A. published this content on 12 November 2018 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 12 November 2018 10:18:04 UTC