Senvion S.A.: Senvion GmbH signs EUR 100m loan agreement with its lenders and main bond holders

Senvion S.A. (IRSH) Senvion S.A.: Senvion GmbH signs EUR 100m loan agreement with its lenders and main bond holders 17-Apr-2019 / 18:46 CET/CEST Dissemination of a Regulatory Announcement that contains inside information according to REGULATION (EU) No 596/2014 (MAR), transmitted by EQS Group. The issuer is solely responsible for the content of this announcement. Senvion S.A.: Senvion GmbH signs EUR 100m loan agreement with its lenders and main bond holders Luxembourg, 17April 2019: Senvion GmbH - the main operative business entity of the Senvion Group - and its lenders and main bond holders have signed a binding loan agreement, setting forth terms for a EUR 100m so-called 'Massekredit'. The debtor-in-possession (DIP) facility enables Senvion Group to continue its business operations following last week's self-administration filing for certain entities of Senvion Group. The loan facility has received all Board approvals and allows substantial drawings already this week, thus enabling the company to stabilize its business operations and provide funds to its non-insolvent subsidiaries. The Management Board Senvion Investor Relations contact (Notifying Person): Anja Siehler Senior Manager - Capital Markets phone: [phone] - 5285 email: [e-mail] Contact: Anja Siehler Tel: [phone] Mobil: [phone] E-mail: [e-mail]

ISIN:	LU1377527517, XS1223808749, XS1223809390
Category Code:	MSCU
TIDM:	IRSH
LEI Code:	549300WUKZSK5CX6SM09
OAM Categories:	2.2. Inside information
Sequence No.:	8247
EQS News ID:	801439

End of Announcement	EQS News Service