Kahl am Main, March 22, 2016 - The second bondholder meeting of the SINGULUS TECHNOLOGIES AG with respect to the SINGULUS bond 2012/2017 (ISIN DE000A1MASJ4 / WKN A1MASJ) resolved on February 15, 2016 under agenda item 4 to defer the claim due on March 23, 2016 to payment of interest for the SINGULUS bond until March 23, 2017. In addition, this bondholder meeting resolved to exchange the debentures of the SINGULUS bond (i.e. the principal claim including accrued and future interest) for purchase rights for new shares of the company and to bonds newly issued by the company in the amount of 20 % of the former nominal value. Against the background of these resolutions the company is prevented from paying interest for the SINGULUS bond on March 23, 2016.

Profile SINGULUS TECHNOLOGIES

SINGULUS TECHNOLOGIES develops and builds machines for economical and resource-efficient production processes. The application areas include vacuum thin-film and plasma coating for wet-chemical processes as well as thermal process technologies.

For all machines, processes and applications SINGULUS TECHNOLOGIES utilizes its know-how in the areas of automation and process technology in order to develop additional, attractive work areas with innovative products next to the existing application areas of Solar, Semiconductors and Optical Disc.

Singulus Technologies AG issued this content on 22 March 2016 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 22 March 2016 20:27:03 UTC

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