October 3, 2018 - Newburyport, Massachusetts - UFP Technologies, a producer of custom-engineered components, specialty packaging, and products, will be exhibiting at Foam Expo Europe in Hannover, Germany from October 16-18 at Booth 229.

At this year's expo, UFP Technologies will be showcasing a variety of solutions for the automotive, aerospace/defense, and medical markets. We strive to deliver innovation across these industries by designing solutions which improve vehicle performance, protect vital combat equipment for our soldiers, and enhance patient safety and comfort.

With diverse manufacturing capabilities including compression molding, lamination, and die cutting along with our vast array of foams from top suppliers across the globe, UFP Technologies has the resources, knowledge, and experience to solve our customers' most complex challenges.

Foam Expo is Europe's first free-to-attend exhibition and conference for manufacturers and buyers of technical foam materials, products, and services. The show will highlight the latest product applications, services, and equipment from markets including aerospace, automotive, construction, medical, packaging, and sports and leisure.

Click here to register for a free pass.

About UFP Technologies
 UFP Technologies, Inc. (NASDAQ: UFPT) is a producer of innovative, custom-engineered components, products, and specialty packaging. Using foams, plastics, composites, and natural fiber materials, we design and manufacture a vast range of solutions primarily for the medical, automotive, aerospace, defense, electronics, consumer, and industrial markets. Our team acts as an extension of our customers' in-house research, engineering and manufacturing groups, working closely with them to solve their most complex product and packaging challenges. For our customers, innovation takes many shapes. But each solution is shaped by a level of design, materials and process expertise that is unique to UFP Technologies.

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UFP Technologies Inc. published this content on 03 October 2018 and is solely responsible for the information contained herein. Distributed by Public, unedited and unaltered, on 03 October 2018 18:47:05 UTC