Wen Zhi Wang

Director of Finance/CFO at NINGBO FANGZHENG AUTOMOBILE MOULD CO.,LTD.

50 year

Producer Manufacturing

Consumer Services

Electronic Technology

Profile

Wen Zhi Wang is an Independent Director at Shenzhen Han’s Assembly & Testing Technology Co., Ltd.
and the Chief Financial Officer & Deputy General Manager at Ningbo Fangzheng Automobile Mould Co., Ltd.
He previously held the position of Chief Financial Officer & Deputy General Manager at Shenzhen Silver Basis Technology Co., Ltd.
and Chief Financial Officer at Shenzhen Yinghe Technology Co., Ltd.

Wen Zhi Wang active positions

Companies	Position	Start
NINGBO FANGZHENG AUTOMOBILE MOULD CO.,LTD.	Director of Finance/CFO	2023-12-10
Shenzhen Han’s Assembly & Testing Technology Co., Ltd. Shenzhen Han’s Assembly & Testing Technology Co., Ltd. SemiconductorsElectronic Technology Shenzhen Han’s Assembly & Testing Technology Co., Ltd. engages in the manufacture of special equipment for light emitting diode (LED), and semiconductor packaging and testing processes. Its products include wire bonding equipment, die bonding equipment, test taping equipment, and test sorting equipment. The company was founded on September 10, 2007 and is headquartered in Shenzhen, China.	Director/Board Member	2022-01-24

All active positions of Wen Zhi Wang

Former positions of Wen Zhi Wang

Companies	Position	End
SHENZHEN YINGHE TECHNOLOGY CO., LTD	Director of Finance/CFO	-
SHENZHEN SILVER BASIS TECHNOLOGY CO., LTD.	Director of Finance/CFO	-

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Linked companies

Listed companies	3
NINGBO FANGZHENG AUTOMOBILE MOULD CO.,LTD.	Producer Manufacturing
SHENZHEN SILVER BASIS TECHNOLOGY CO., LTD.	Consumer Services
SHENZHEN YINGHE TECHNOLOGY CO., LTD	Producer Manufacturing

Private companies	1
Shenzhen Han’s Assembly & Testing Technology Co., Ltd. Shenzhen Han’s Assembly & Testing Technology Co., Ltd. SemiconductorsElectronic Technology Shenzhen Han’s Assembly & Testing Technology Co., Ltd. engages in the manufacture of special equipment for light emitting diode (LED), and semiconductor packaging and testing processes. Its products include wire bonding equipment, die bonding equipment, test taping equipment, and test sorting equipment. The company was founded on September 10, 2007 and is headquartered in Shenzhen, China.	Electronic Technology