Log in
E-mail
Password
Remember
Forgot password ?
Become a member for free
Sign up
Sign up
Settings
Settings
Dynamic quotes 
OFFON

MarketScreener Homepage  >  News  >  Companies  >  All News

News : Companies
Latest NewsCompaniesMarketsEconomy & ForexCommoditiesInterest RatesBusiness LeadersFinance ProfessionalsCalendarSectors

Advanced Fan-out Technology Breakthrough: Deca Technologies' M-Series™ Identified in Samsung S10, Xiaomi Mi 9 and LG G8 Handsets

share with twitter share with LinkedIn share with facebook
share via e-mail
0
08/14/2019 | 11:44pm EDT

TEMPE, Ariz., Aug. 14, 2019 (GLOBE NEWSWIRE) -- Deca Technologies, a wafer-level electronic interconnect solutions provider to the semiconductor industry, today announced that Industry researchers Yole and TechInsights have independently confirmed that M-Series™ fan-out wafer-level packaging (FOWLP) technology created by Deca Technologies has been adopted by Qualcomm for power management integrated circuit (PMIC) devices in Samsung’s flagship S10 handset, along with the Xiaomi Mi 9 and LG G8 handsets.

https://www.i-micronews.com/new-commercialization-of-deca-technologies-fan-out-technology/

https://techinsights.com/products/qualcomm-pm8150-advanced-packaging-essentials

A remarkable development within the initial application is the use of M-Series fan-out technology to create a “protected fan-in WLCSP” where all the solder balls remain within the silicon area. Deca’s patented M-Series structure and methods are used to encapsulate the active semiconductor side and four surrounding vertical sidewalls of the device. Additionally, Deca’s patented Adaptive Patterning™ technology is used in the design and manufacturing processes.

Utilization of Deca’s M-Series processes to encapsulate and protect the device allows both integrated circuit (IC) producers and original equipment manufacturers (OEMs) to approach zero defects related to silicon cracking or chipping.

Sidewall chipping of conventional fan-in wafer-level chip-scale packages (WLCSPs) remains a key quality concern for cell phone OEMs and IC companies throughout the supply chain. Chipping or cracking defects can arise during device singulation, in shipping or in the board mounting process due to the exposed silicon. Adopting M-Series FOWLP mitigates this problem.

“A growing community of semiconductor customers and end electronic product OEMs is taking notice of the benefits that M-Series can provide. Outstanding board level reliability performance coupled with extreme miniaturization vs. competing alternatives is the starting point,” said Garry Pycroft, VP Sales & Marketing at Deca Technologies. “The fully protected nature not only drives elimination of silicon cracking and chipping, it also provides benefit for light-sensitive devices, blocking over 10X the ambient light compared with conventional fan-in WLCSP. Radio frequency device users also see improved electrical performance capabilities with the unique dielectric structure between the active device and redistribution layers.”

A cross-sectional image of a protected fan-in device recently built at Deca Technologies’ Philippines location is shown to the right.

With noted success in the low-density fan-out market, Deca is working to scale its M-Series and Adaptive Patterning™ technologies to support the anticipated strong growth of chiplets and heterogeneous integration. In the near future, Deca’s unique approach will allow scaling in both directions simultaneously: scaling up from 300mm round to 600mm square manufacturing format while also scaling down from 8µm line and space (l/s) to below 2µm l/s.

For more information on M-Series, please visit:
http://www.decatechnologies.com/deca-technologies-transforming-electronic-interconnect/19530-2/

About Deca Technologies

Founded in 2009, Deca Technologies is an electronic interconnect solutions provider offering advanced interconnect foundry services to the semiconductor industry. Headquartered in Tempe, Arizona with high-volume manufacturing in Asia, Deca Technologies is a privately held company with leading investors including Cypress Semiconductor Corp. (NASDAQ: CY), ASE Technology Holding Co., Ltd. (NYSE: ASX), Qualcomm Ventures (NASDAQ: QCOM) and SunPower (NASDAQ: SPWR). Deca’s mission is to deliver an exceptional customer experience through its proprietary and transformative electronic interconnect technology. Integrating its solar and semiconductor background, Deca leverages unique equipment, processes and operational methods to break down traditional barriers in the continued adoption and growth of next-generation wafer-level electronic interconnect. For more information, please visit www.decatechnologies.com.

Company Contact:
Garry Pycroft
Vice President of Sales & Marketing
Deca Technologies
Garry.Pycroft@Decatechnologies.com

Press Contact:
Paige Hoffman
Media Relations, Deca Technologies
Kiterocket
(701) 373-5093
PHoffman@Kiterocket.com

A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/676145f5-29eb-4f37-a4de-5b6be8828682

Primary Logo

The cross-sectional image of a protected fan-in device.

Recently built at Deca Technologies’ Philippines location.

© GlobeNewswire 2019
share with twitter share with LinkedIn share with facebook
share via e-mail
0
Latest news "Companies"
10:12pDATA#3 : 19th August 2019 Data#3 Named Lenovo Reseller of the Year Platinum Partner
PU
10:12pBASE RESOURCES : 19/08/2019 Notice of Change of Interests of Substantial Holder - Pacific Road (166.0 KiB) View Document
PU
10:10pGlobal logistics software group, WiseTech Global , acquires US-based Depot Systems
AW
09:52pSARACEN MINERAL : Record Profit as Production Rises and Costs Fall
PU
09:52pSARACEN MINERAL : Appendix 4E and FY2019 Financial Report
PU
09:51pCathay Pacific shares rise 2.3 percent after CEO Hogg resigns
RE
09:49pAustralian regulator promises big bank lawsuits by year-end - media
RE
09:46pOKLO RESOURCES : Change of Director's Interest Notice - S Taylor
PU
09:46pSINOPEC ENGINEERING : SEG Announces 2019 Interim Results——Strengthened Management, Steadily Improved Operat..
PU
09:37pADX ENERGY : Iecea Mica 1 Well Drilling Update No. 3
PU
Latest news "Companies"
Advertisement