Advanced Semiconductor Engineering Inc. announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line. This milestone expands economies of scale by enabling a seamless transition from wafer-level packaging to panel-level packaging while preserving design rule consistency across FOCoS and FOCoS-Bridge packaging platforms. The new panel line is expected to enter production in the first half of 2027. The automated panel-level packaging line supports 310mm × 310mm format and is compatible with advanced packaging platforms including FOCoS and FOCoS-Bridge, delivering line/space capabilities of 2/2µm and 8/8µm, respectively.
By transitioning from traditional round wafers to rectangular panels, Advanced Semiconductor Engineering Inc. enables significantly greater usable area?up to 96,100 mm2 per panel?allowing for more dies per unit and improved material efficiency. This shift to panel-level packaging addresses critical industry challenges, including rising interposer sizes and declining wafer-level efficiency. The larger panel format supports higher throughput and reduced cycle time, while enabling integration of increasingly complex multi-die architectures.
These benefits are especially impactful for AI data center and HPC applications, where demand for larger package sizes and higher I/O density continues to accelerate. The panel-level platform delivers higher throughput through large-area processing and reduced tool change steps, while offering a flexible foundation for heterogeneous integration and system-in-package (SiP) solutions. It supports a wide range of applications including AI, HPC, networking, high-end gaming, and edge AI, helping customers meet performance targets with greater manufacturing efficiency and faster time-to-market.
The new solution also reinforces its competitive differentiation through faster cycle times, scalable manufacturing, and alignment with long-term industry roadmaps for chiplet-based architectures and large-form-factor integration. As the industry moves beyond the limitations of traditional wafer-based processes, Advanced Semiconductor Engineering Inc. continues to lead in delivering advanced packaging solutions that enable new levels of system performance and efficiency. Advanced Semiconductor Engineering Inc. will participate in the 76th IEEE Electronic Components and Technology Conference (ECTC) in Orlando, Florida, from May 26 to May 29, 2026.
