Advantest Corporation and Tokyo Seimitsu Co., Ltd. announced plans to co-develop a new die-level prober, designed for the testing of high-performance computing (HPC) devices. Semiconductors are expected to become increasingly advanced and complex in the coming years. To promptly meet evolving market needs and deliver high-performance total test solutions to customers, close collaboration across the semiconductor value chain is essential.
Advantest and Tokyo Seimitsu will jointly develop die-level prober, leveraging their respective expertise to deliver advanced probing capabilities essential for testing AI and high-performance computing (H PC) devices. AI and high-performance computing ("HPC") devices, such as GPUs and CPUs used in servers, require extremely high computational performance for AI model training, inference and execution. These devices often employ advanced 2.5D/3D packaging technologies, which generate significant heat during massive data processing.
As a result, controlling temperature during test is a major challenge. Through this collaboration, the two companies will strengthen next-generation probing and handling technologies to address these challenges and contribute to the growth of the AI/HPC market.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.
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