HyperLight Corporation, United Microelectronics Corporation, Wavetek Microelectronics Corporation, and Jabil Inc. announced a collaboration to accelerate the deployment of thin-film lithium niobate photonics into hyperscale AI data center interconnects. The collaboration brings together HyperLight?s thin-film lithium niobate photonic technology, United Microelectronics Corporation and Wavetek Microelectronics Corporation?s qualified foundry manufacturing, and Jabil Inc.?s expertise in high-volume manufacturing and assembly to support deployment of next-generation optical modules at data-center scale. HyperLight Corporation and Jabil Inc. have worked closely to integrate thin-film lithium niobate-based photonic devices into next-generation optical transceiver platforms. Backed by scalable 6-inch and 8-inch wafer manufacturing capabilities of United Microelectronics Corporation and Wavetek Microelectronics Corporation, and leveraging Jabil Inc.?s expertise in supply chain management and system integration, this collaboration paves the way for mass market adoption of HyperLight Corporation?s thin-film lithium niobate Chiplet Platform for energy efficient optical modules suitable for hyperscale data center environments.

United Microelectronics Corporation has supported the transition of thin-film lithium niobate from early development into qualified foundry manufacturing through its work with HyperLight Corporation. By extending this collaboration to include system-level integration with Jabil Inc., United Microelectronics Corporation is helping establish a complete manufacturing and deployment path that supports the scale, reliability, and capacity requirements of AI data center infrastructure.