Intel Corporation and Google announced a multiyear collaboration to advance the next generation of AI and cloud infrastructure, reinforcing the critical role of CPUs and custom infrastructure processing units (IPUs) in scaling modern, heterogeneous AI systems. Through this collaboration, Intel and Google will align across multiple generations of Intel Xeon processors to improve performance, energy efficiency and total cost of ownership across Google?s global infrastructure. In parallel, Intel and Google are expanding their co-development of custom ASIC-based IPUs. These programmable accelerators offload networking, storage and security functions from host CPUs - improving utilization, increasing efficiency and enabling more predictable performance across hyperscale AI environments.
IPUs are a critical component of modern data center architectures. By handling infrastructure tasks traditionally managed by CPUs, they unlock greater effective compute capacity and allow cloud providers to scale more efficiently without increasing overall system complexity. Together, Xeon CPUs and IPUs form a tightly integrated platform balancing general-purpose compute with purpose-built infrastructure acceleration to deliver more efficient, flexible and scalable AI systems. The expanded collaboration reflects a shared commitment to advancing open, scalable infrastructure for the AI era.
By combining general-purpose compute with purpose-built infrastructure acceleration, Intel and Google are enabling a more balanced approach to AI system design - one that improves utilization, reduces complexity and scales more efficiently. Together, the companies are strengthening the foundation for the next generation of AI-driven cloud services?supporting continued innovation across enterprises, developers and users worldwide.
Intel Corporation is the world leading manufacturer of semiconductor. Net sales break down by family of products and services as follows:
- computing architectures products (69.7%): processors and microprocessors (Pentium, Intel Xeon brands, etc.), graphics cards, chips and motherboards, connectivity products, cellular modems, Ethernet controllers, network components, storage products, etc. for PCs, servers, data centers, cloud networks, workstations, notebooks, Internet of Things, graphics architectures, intelligent peripherals and communications infrastructures. The group also develops associated software;
- wafer manufacturing services (25.3%): accelerators, monolithic chips, silicon wafers, etc. The group also offers chiplet software and mask manufacturing equipment for advanced lithography;
- other (5%).
Net sales (including intragroup) are distributed geographically as follows: the United States (29.8%), China (24%), Singapore (18.1%), Taiwan (14.5%) and other (13.6%).
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