QuickLogic Corporation announced it will demonstrate its newly released RadPro FPGA development kit in Booth 15 at the 41st Hardened Electronics and Radiation Technology (HEART) Conference April 13?17, 2026 in Shreveport, Louisiana. The development kit includes QuickLogic's first RadPro FPGA that is fabricated in the U.S. on GlobalFoundries industry proven 12nm process technology, which is commonly used by the DIB for radiation hardened ASICs. The RadPro FPGA was developed to meet the operational requirements of various active programs in development with the DIB.
The core RadPro FPGA technology is extensible to eFPGA Hard IP for radiation hardened ASIC and SoC designs. QuickLogic is accepting orders now for its RadPro FPGA Dev Kits. Shipments will be scheduled following the HEART Conference.
