Renesas Electronics Corporation announced its radiation-hardened ICs are being used in NASA?s Artemis II mission, which successfully launched from the Kennedy Space Center in Florida on April 1. Four astronauts are now en route to orbit the moon aboard NASA?s Orion spacecraft as part of NASA?s Artemis II mission, taking humans farther from Earth than they have traveled in over fifty years. Within the Artemis II core systems, including the Orion capsule and Space Launch System rocket, Renesas rad-hard ICs are used across multiple subsystems. These Intersil-branded devices are embedded in the space vehicle?s avionics and safety launch system, helping to regulate and distribute power, maintain signal integrity and support onboard computing. These specialized ICs are built to operate reliably when exposed to the elevated levels of radiation and extreme temperatures that are typical of human space missions.
The Renesas Intersil brand has a long history in the space industry spanning more than six decades, beginning with the founding of Radiation Inc. in 1950. Since then, virtually every satellite, shuttle launch and deep-space exploration mission has included Intersil-branded products. Renesas leverages this experience to deliver efficient, thermally-optimized and highly-reliable SMD, MIL-STD-883 and MIL-PRF 38535 Class-V/Q Intersil-branded products for the defense, high-reliability, and rad-hard space markets.
Renesas Intersil-brand rad-hard ICs support subsystems for mission critical applications in data communications transfer, power supplies and power conditioning, general protection circuitry, and telemetry, tracking and control.
