(Alliance News) - Seco Spa announced Thursday that it will showcase new Edge AI solutions developed in collaboration with Qualcomm Technologies at embedded world 2026, taking place from March 10 to 12 in Nuremberg. These innovations are based on the Dragonwing platforms.
As the company explained in a statement, the goal is to strengthen the group's hardware and software offering for high-performance industrial applications that operate independently from the cloud.
Among the new products is the SOM-COMe-CT6-Dragonwing-IQ-X module, designed for industrial PCs, advanced HMIs, and automation systems, featuring AI acceleration up to 45 TOPS and reliable operation in harsh industrial environments.
Seco has also expanded its roadmap with SMARC IQ8 and COM-HPC Mini IQ9 solutions, expected by the third quarter of 2026.
Also highlighted are Modular Vision, an industrial HMI with real-time Edge AI, and the Modular Link IQ-615 gateway for smart grids and industrial infrastructure. These solutions are integrated with the Clea software stack to enable secure device management, OTA updates, and end-to-end AI deployment.
Seco shares are down 0.9% at EUR2.65 per share.
By Claudia Cavaliere, Alliance News reporter
Comments and questions to redazione@alliancenews.com
Copyright 2026 Alliance News IS Italian Service Ltd. All rights reserved.

















