Veeco Instruments Inc. announced that a leading semiconductor memory company has selected Veeco's laser spike annealing (LSA system) for evaluation in its advanced DRAM R&D group. This shipment marks an expansion of Veeco's penetration into the DRAM market and represents a significant step toward high-volume manufacturing (HVM) adoption for next-generation DRAM and high bandwidth memory (HBM) technologies. The evaluation period is expected to take around one year, with follow-on orders expected in 2027 and beyond.
LSA is a millisecond annealing technology used in front-end semiconductor manufacturing to lower the resistance of key transistor structures by activating dopants. Veeco's LSA system is capable of high-temperature annealing while staying within reduced thermal budgets of advanced devices at nodes. The system delivers market-leading performance and best-in-class cost of ownership, making it a preferred solution for advanced memory applications.
As the demand for HBM and DRAM continues to rise--driven by AI workloads and next-generation computing, Veeco's LSA technology is positioned to support the evolving needs of tier 1 semiconductor manufacturers. The HBM market is experiencing rapid growth, with Yole market research estimating that the market will grow at a compound annual growth rate (CAGR) of nearly 30% through 2030, reaching $100B or more in annualized revenues.
