Tokyo Seimitsu Co., Ltd. Announces Dividend for the Second Quarter-Ended September 30, 2025, Payable on December 8, 2025; Provides Dividend Guidance for the Fiscal Year Ending March 31, 2026
Tokyo Seimitsu Co., Ltd. announced dividend of JPY 111.00 per share for the second quarter-ended September 30, 2025 against JPY 114.00 per share paid a year ago. Dividend Payment Date (planned) is December 8, 2025.
The company provided dividend guidance for the fiscal year ending March 31, 2026. For the year-end, the company expects to pay dividend of JPY 111.00 per share against JPY 139.00 per share paid a year ago.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.
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Tokyo Seimitsu Co., Ltd. Announces Dividend for the Second Quarter-Ended September 30, 2025, Payable on December 8, 2025; Provides Dividend Guidance for the Fiscal Year Ending March 31, 2026
