Share class: ACM Research, Inc.

VoteQuantityFree-FloatCompany-owned sharesTotal Float
Stock A 1 5,021,811 0 0 77.92 %
Stock B 1 57,606,036 48,800,163 ( 84.71 %) 0

Major shareholders: ACM Research, Inc.

NameEquities%Valuation
BlackRock Advisors LLC
12.06 %
7,219,036 12.06 % 241 M $
Vanguard Fiduciary Trust Co.
8.097 %
4,846,413 8.097 % 162 M $
LSV Asset Management
4.184 %
2,504,305 4.184 % 84 M $
Shanghai Science & Technology Venture Capital Group Co. Ltd.
3.907 %
2,338,510 3.907 % 78 M $
Triata Capital Ltd.
3.347 %
2,003,225 3.347 % 67 M $
3.325 %
1,990,254 3.325 % 66 M $
2.921 %
1,748,548 2.921 % 58 M $
Southeastern Asset Management, Inc.
2.482 %
1,485,687 2.482 % 50 M $
First Sentier Investors (Hong Kong) Ltd.
2.272 %
1,359,969 2.272 % 45 M $
Geode Capital Management LLC
2.211 %
1,323,502 2.211 % 44 M $
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NameEquities%Valuation
81.91 %
4,166,808 81.91 % 139 M $
5.898 %
300,000 5.898 % 10 M $
2.949 %
150,003 2.949 % 5 M $

Breakdown by shareholder type

Institutional66.4%
Individuals13.2%
Other4.3%
State Street Corp.3.33%
Schweizerische Nationalbank0.17%
SEI Investments Co.0.06%
Manulife Financial Corp.0.04%
Danske Bank A/S0.02%
MidWestOne Financial Group, Inc.0.01%
Unknown12.47%

Based on 1000 largest holdings

Geographical origin of shareholders

United States
56.15%
Individuals
13.2%
Hong Kong
6.22%
United Kingdom
5.04%
China
3.91%
Austria
0.73%
Canada
0.61%
Ireland
0.44%
Switzerland
0.43%
Cayman Islands
0.41%
France
0.08%
Norway
0.07%
Australia
0.06%
Puerto Rico
0.04%
Singapore
0.04%
Denmark
0.02%
Thailand
0.02%
Spain
0.02%
Germany
0.02%
South Korea
0.01%
Japan
0.01%

Based on 1000 largest holdings

Logo ACM Research, Inc.
ACM Research, Inc. develops, manufactures, and sells production equipment and provides service solutions for single-wafer or batch wet cleaning, electroplating, stress-free polishing, plasma-enhanced chemical vapor deposition (PECVD), track and thermal processes. The Company offers two principal models of wet wafer cleaning equipment based on its Space Alternated Phase Shift (SAPS) technology, Ultra C SAPS II and Ultra C SAPS V. It has also developed Timely Energized Bubble Oscillation (TEBO) technology for application in wet wafer cleaning during the fabrication of two-dimensional (2D) and three-dimensional (3D) wafers with fine feature sizes. It has designed these tools for use in fabricating foundry, logic, and memory chips, including dynamic random-access memory (DRAM), 3D NAND-flash memory chips, and compound semiconductor chips. The Company also develops, manufactures, and sells a range of advanced packaging tools to wafer assembly and packaging customers.
Employees
2,023
Calendar
More about the company