ACM RESEARCH, INC. “This order represents a great opportunity for ACM from a global semiconductor company with operations in China,” said Dr.
ACM’s proprietary Space Alternated Phase Shift (SAPS) advanced wafer cleaning technology employs alternating phases of megasonic waves in the gap between a megasonic transducer and the wafer. Unlike the stationary megasonic transducers used in previous generations of megasonic wafer cleaning systems, SAPS technology moves or tilts the transducer while the wafer rotates, enabling megasonic energy to be delivered uniformly across all points on the wafer, even if the wafer is warped. SAPS is a faster process than conventional megasonic cleaning, does not experience material loss or create a rough wafer surface. SAPS achieves more thorough, comprehensive cleaning without damage to device features and has been demonstrated to 10nm and beyond.
About
ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes, which are critical to advanced semiconductor device manufacturing and wafer-level packaging. The company is committed to delivering customized, high performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield. For more information, visit www.acmrcsh.com.
SAPS, ULTRA C SAPS and the ACM logo are trademarks of
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