“ACM’s Single-Wafer SPM tool builds on the proven performance of our Ultra C Tahoe, which addresses most SPM process steps that operate at regular temperatures,” said Dr.
Most of today’s SPM wet processes operate with sulfuric acid and peroxide mixture temperatures below 145°C. These processes are widely used for PR stripping and post-etch, medium dose of post-implant and post-CMP cleaning. ACM’s Ultra C Tahoe, introduced in 2018, combines bench SPM and single-wafer cleaning in an integrated system to provide industry-proven benefits for these process steps. Tahoe delivers improved process performance with cost savings on chemicals through significantly reduced sulfuric acid consumption and sulfuric acid waste generation.
As technology nodes extend to 10nm and beyond, the number of SPM process steps that must use higher temperatures of 145°C to more than 200°C is increasing. PR stripping after high-dose energy implant, wet stripping without using a dry ash process, and special metal film removal processes all require higher temperature SPM. ACM’s new Single-Wafer SPM tool addresses this transition with support for higher temperatures, and delivers additional advantages including shorter process times, and organic defect removal with significantly less film loss than most post-clean and PR wet strip processes.
“ACM’s Tahoe platform sets the bar for mainstream regular temperature SPM performance with best-in-class environmental performance that uses a fraction of the chemical consumption of other approaches,” continued Dr. Wang. “More advanced production nodes increasingly require higher dose ion implantation. These higher doses harden the photoresist and demand higher temperature SPM for effective defect removal. ACM’s new Single-Wafer SPM tool addresses this need, combining high temperature support with an optimized process chamber. This allows ACM to overcome the hardened photoresist and organically remove, more quickly and effectively, defects after key process steps.”
The Single-Wafer SPM tool uses a unique multilevel gradient heating system to preheat sulfuric acid, which is then mixed with hydrogen peroxide to achieve super high temperatures. ACM’s chamber configuration supports additional chemicals and features a chemical in-line mix (CIM) system for dynamically setting the chemical mixing ratio and temperature in the process. The tool also brings to bear additional advanced options that can be incorporated into the process chamber, including ACM’s patented SAPS and TEBO megasonic cleaning technologies.
ACM has shipped two systems to
Contact us to learn more about the Single-Wafer SPM tool.
About
ACM develops, manufactures and sells semiconductor process equipment for single-wafer or batch wet cleaning, electroplating, stress-free polishing and thermal processes that are critical to advanced semiconductor device manufacturing as well as wafer-level packaging. The company is committed to delivering customized, high-performance, cost-effective process solutions that semiconductor manufacturers can use in numerous manufacturing steps to improve productivity and product yield.
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