Advantest Corporation will feature over a dozen of its latest products and services at the SEMICON Japan trade show on December 14-16 in Tokyo. Under the theme Beyond the Technology Horizon, Advantest's exhibit will showcase its contributions to accelerating the development of revolutionary test technology, including AI, high-performance computing (HPC), cloud-based technologies and high-power ICs. In addition to showcasing advanced test technologies, Advantest will also highlight its ESG initiatives and action plans.

Exhibition: The company's product showcase in booth #1549, located in East Hall 1, will demonstrate how the company is adding customer value to the evolving semiconductor value chain through various test solutions and services. This year's displays will include: NEW: inteXcell, first-ever fully integrated and unified test infrastructure to combine the T5835 tester into minimal-footprint test cells, ideal for advanced memory IC final testing; NEW: E5620 Defect Review Scanning Electron Microscope (DR-SEM) for precision review and classification of ultra-small photomask defects; NEW: XPS128+HV universal VI and power supply card for V93000 EXA Scale SoC test system that lowers the cost of test for power management ICs and other high-voltage devices; NEW: LCD HP multi-channel digitizer module that addresses high-accuracy and high-voltage measurement demands for testing emerging display driver ICs when combined with the T6391 SoC tester; T2000 SoC test systems with improving Rapid Development Kit (RDK) usability, which accelerates test program development for all SoCs, including complex automotive and power analog applications; NEW: MPT3000 solid state drive (SSD) test systems addressing test requirements associated with PCI Express fifth generation (PCIe Gen 5), Compute Express Link™ (CXL™) and NVMe SSDs; Die level test for 2.5D and 3D package devices with accurate die alignment technology; ACS open ecosystem enabling streaming data access and real-time analytics with integrated test software and hardware monitoring and control to improve semiconductor device yield, quality, and capacity; Software solutions and services, including CONNECT+ and Adaptive Probe Cleaning.