Aehr Test Systems announced it has received purchase orders totaling $3.0 million from its lead silicon carbide test and burn-in customer for multiple WaferPak™ Contactors and a FOX WaferPak Aligner to meet their increased production capacity needs for power semiconductors for the electric vehicle market. This customer is a leading Fortune 500 supplier of semiconductor devices with a significant customer base in the automotive semiconductor market. These WaferPaks and the WaferPak Aligner are expected to ship within the next six months to accompany the previously ordered FOX-XP systems announced last month. The FOX-XP system, available with multiple WaferPak Contactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, is capable of functional test and burn-in/cycling of integrated devices such as silicon carbide (SiC) power devices, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, and other ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.