Aehr Test Systems announced it has received initial orders totaling nearly $1.2 million from a new customer in China for its FOX-P™ test and burn-in solution for production test of silicon photonics devices. This new customer will also be providing contract manufacturing services to an existing customer of Aehr Test as that customer ramps production in China as well as other international markets. The initial order includes a FOX-NP™ full wafer system and multiple DiePak Carriers® to be used to meet this customer’s new product requirements and initial production needs. The system is configured with two blades which allows for both wafer level as well as singulated die and module level test and burn-in using Aehr’s proprietary full wafer WaferPak Contactors or singulated die and module DiePak Carriers. The system ships within Aehr’s current fiscal first quarter ending August 31, 2021 with the DiePaks to follow in the next couple of months. The FOX-XP system, available with multiple WaferPak Contactors (full wafer test) or multiple DiePak™ Carriers (singulated die/module test) configurations, is capable of functional test and burn-in/cycling of integrated devices such as silicon carbide power devices, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, and other ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.