Aehr Test Systems announced it has received an initial order exceeding $1.2 million from a current FOX-XPTMMulti Wafer and Singulated Die/Module test and burn-in system customer for its proprietary FOXTM DiePak Carriers. This customer is a supplier of sensors to a major mobile device, personal computer, and consumer electronics manufacturer. The FOX-XP system, available with multiple WaferPak Contactors (full wafer test) or multiple DiePak Carriers (singulated die/module test) configurations, is capable of functional test and burn-in/cycling of integrated devices such as silicon carbide (SiC) power devices, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, and other ICs in either wafer formfactor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.