Aehr Test Systems announced it has received $4.4 million in orders from its lead silicon carbide test and burn-in customer for multiple WaferPak™ full wafer Contactors to meet their increased production capacity needs for silicon carbide power semiconductors for the electric vehicle market. These WaferPak Contactors are expected to ship by the end of Aehr's fiscal third quarter ending February 28, 2023. The FOX-XP system, available with multiple WaferPak Contactors (full wafer test) or multiple DiePakTM Carriers (singulated die/module test) configurations, is capable of functional test and burn-in/cycling of integrated devices such as silicon carbide power devices, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, and other ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.