Capitalization 9.59B P/E ratio 2024 *
22.4x
P/E ratio 2025 * 15.7x
Enterprise value 7.79B EV / Sales 2024 *
1.42x
EV / Sales 2025 * 1.21x
Free-Float
38.09%
Yield 2024 *
0.92%
Yield 2025 * 0.98%
More valuation ratios * Estimated data
Dynamic Chart
1 day-5.18%
1 week-5.48%
Current month-2.65%
1 month+4.65%
3 months+30.48%
6 months+17.21%
Current year+17.10%
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1 week
38.90
Extreme 38.9
41.53
1 month
38.65
Extreme 38.65
44.86
Current year
28.15
Extreme 28.145
44.86
1 year
17.58
Extreme 17.5814
44.86
3 years
14.89
Extreme 14.89
44.86
5 years
5.40
Extreme 5.4
44.86
10 years
4.01
Extreme 4.01
44.86
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Insider TitleAgeSince
Chief Executive Officer 66 14-01-14
Director of Finance/CFO 50 04-12-31
Investor Relations Contact - -
Insider TitleAgeSince
Director/Board Member 65 14-07-31
Chairman 88 97-08-31
Director/Board Member 68 06-01-31
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Change 5d. change 1-year change 3-years change Capi. ($)
-5.18%-5.48%+39.94%+69.61% 10.12B
-3.40%-4.51%+35.07%+30.18% 367B
-5.19%-5.97%+42.38%+42.11% 125B
-5.74%-4.46%+48.03%+92.48% 90.84B
+5.18%-5.48%+56.11%+50.00% 22.72B
-5.08%-6.79%+18.94%+4.19% 19.81B
-6.60%-4.40%+84.76%+194.54% 10.44B
-4.42%-6.12%+66.79%+166.60% 8.16B
-6.47%-4.05%+147.71%+212.22% 5.25B
-1.18%-3.28%-54.14%-51.72% 5.2B
Average -3.06%-7.37%+48.56%+81.02% 66.55B
Weighted average by Cap. -2.52%-6.45%+39.89%+46.49%
See all sector performances
Ratios2024 *2025 *
Net sales 6.55B 7.27B
Net income 409M 596M
Net Debt -310M -785M
More financial data * Estimated data
Logo Amkor Technology, Inc.
Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company is engaged in the outsourcing of semiconductor packaging and test services. It designs and develops packaging and test technologies focused on advanced packaging solutions, including artificial intelligence. Its packaging and test services are designed to meet application and chip-specific requirements, including: the required type of interconnect technology; size; thickness; and electrical, mechanical, and thermal performance. It provides turnkey packaging and test services including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The Company offers services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. It allows IDMs to outsource packaging and test services and focus their investments.
Employees
28,700
Calendar
Related indices
More about the company
Date Price Change Volume
24-07-24 38.96 $ -5.18% 1,037,602
24-07-23 41.09 $ -0.24% 917,647
24-07-22 41.19 $ +3.57% 958,140
24-07-19 39.77 $ -3.96% 1,323,038
24-07-18 41.41 $ +0.46% 1,457,948

Delayed Quote Nasdaq, July 24, 2024 at 04:00 pm EDT

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Trading Rating
Investor Rating
ESG Refinitiv
C+
More Ratings
Sell
Consensus
Buy
Mean consensus
OUTPERFORM
Number of Analysts
7
Last Close Price
38.96USD
Average target price
43.86USD
Spread / Average Target
+12.57%
Consensus