ANSYS, Inc. launched Ansys 2021 R2 to provide the power to explore early stage product design and complex system engineering from the nanometer scale of chip design to the mission level of aerospace and defense operating environments. The company's simulation solutions provide an open approach that streamlines engineering via simplified workflows, integrated data management and easy access to high-performance computing power via the cloud. Engineering exploration via simulation is virtually risk free because engineers are no longer bound to an expensive and time-consuming prototype-test-redesign cycle. New design ideas can be virtually evaluated in hours, not weeks, freeing up time to optimize the best design candidates or develop moonshot ideas that redefine markets. With access to nearly limitless computing via Ansys Cloud, engineers who use Ansys 2021 R2 products have the speed and flexibility to ask the "what-if" questions that lead to innovations in autonomous vehicles, chip design, mission-critical connectivity solutions and more sustainable travel via lightweight materials and electrification. Speed improvements are woven throughout the latest Ansys products. Productivity enhancements allow engineers to perform optical simulation meshing up to 20X faster and local meshing up to 100X faster. Ansys 2021 R2 streamlines multistage structural analysis by reducing model sizes and run times by up to 50X. In semiconductors, 2021 R2 provides 3nm-ready Advanced Power Analytics and improves voltage-drop fixing efficiency by 10X, using aggressor identification, what-if analysis and links to engineering change order tools. Using the cloud for semiconductor simulation delivers at least 10X better cost and core-hour efficiency with Ansys 2021 R2. In fluids, Ansys 2021 R2 provides up to a 5X speed increase for high-speed flows to Mach 30 and above, with improved treatment of reaction sources in the density-based solver. Simplified, reduced-order workflows throughout Ansys 2021 R2 provide quick answers to product design and development problems, allowing engineers to concentrate computing power on the best design candidates. The new Phi Plus mesher meets 3D integrated circuit package challenges by significantly accelerating bondwire package electromagnetics and signal integrity analysis. In addition to directly speeding up simulation, Ansys 2021 R2 enables engineers to work more efficiently via an open platform that integrates multiple toolsets. For example, Ansys Mechanical users can embed Python programming language scripts directly into their models to automate the flow using industry standard open-source coding. Automation and collaboration are recurring themes in Ansys 2021 R2 because updates enable teams to efficiently work in an ecosystem that connects early design, simulation, system integration and manufacturing. Many products in the new release incorporate single-click, automated integrations that enable users to leverage additional technology to broaden their scope of simulation. Product and process integration also allows a smooth transfer of data between applications, which increases usability and productivity. For instance, Ansys 2021 R2 delivers new Chip-Package-System and printed circuit board enhanced workflows with automation for IC-on-Package and Multi-Zone PCBs with rigid flex cables, which are popular in modern electronic devices. Data visibility and reuse via dashboards and dedicated libraries further increase the efficiency of engineers using Ansys 2021 R2. Libraries for common digital twin components, electronic components and materials enable engineers to quickly access trusted data. For example, materials management updates enable customers using restricted substances to access the latest Supplier Data Sheets, ensuring products are compliant with global regulations. Compliance, certifications and standards are addressed in many updated products. Ansys 2021 R2 is now a one-stop-shop for embedded software certification across all industries, including the higher safety integrity/assurance levels of DO-178C, ISO 26262, IEC 61508, and EN 50128 standards.