As part of a new multiyear agreement, Ansys simulation tools will help Murata Manufacturing Co. Ltd. (Murata) develop electronic components for efficient, next-generation wireless communication and mobility products. Leveraging Ansys' expansive simulation portfolio will help Murata improve the efficiency, performance and quality of its electronic components, which include radio frequency (RF) modules, multilayer resin substrates known as MetroCirc, and multilayer ceramic capacitors (MLCC).

These components are essential in expanding high-frequency communications to support new-age connectivity demands while upholding sustainability initiatives. The new multiyear agreement builds on Ansys' existing relationship with Murata. Ansys HFSS 3D high-frequency electromagnetic simulation software helped enable the development of an efficient direct-current-resonance method for wireless power transfer systems, which have the potential to charge more devices than batteries or wired systems have the capacity to power.

The team will implement Ansys' electronics system design tools to develop high-frequency devices and communications modules for the future that feature low-power consumption, high-power performance, and improved reliability. With the ability to model phenomena such as electromagnetic interference (EMI), electromagnetic compatibility (EMC), and radio frequency interference (RFI), Ansys tools will help to solve complex and large-scale electronics engineering challenges.