Amkor to Invest $2 Billion in Chip-Packaging Facility to Serve Apple

By Will Feuer

Amkor said it plans to invest about $2 billion in developing a new chip-packaging and test facility in Peoria, Ariz., that will serve Apple.

The finished facility will employ some 2,000 people, Amkor said, and it will be the largest outsourced advanced packaging facility in the U.S.

Amkor said it worked closely with Apple on the strategic vision and initial manufacturing capability of the facility, which will package and test chips produced for Apple at a nearby TSMC fab. Amkor said that when the new facility opens, Apple will be its first and largest customer.

"Apple is committed to help build a new era of advanced manufacturing, right here in the U.S.," Apple Chief Operating Officer Jeff Williams said.

The first phase of the manufacturing plant is expected to be ready for production within the next two to three years, Amkor said. The company said it has applied for CHIPS funding.

Write to Will Feuer at [e-mail]

(END) Dow Jones Newswires

11-30-23 0934ET