Applied Materials, Inc. introduced new technologies and capabilities designed to help its customers accelerate their technology roadmaps for heterogeneous chip design and integration. Applied is combining its leadership technologies in advanced packaging and large-area substrates with industry collaborations to speed the availability of solutions that deliver simultaneous improvements in power, performance, area, cost and time to market (PPACt™). Heterogeneous integration brings new kinds of design and manufacturing flexibility to semiconductor and system companies by allowing chips of various technologies, functions and sizes to be integrated in one package. Applied is already the largest supplier of advanced packaging technologies with optimized products spanning etch, physical vapor deposition (PVD), chemical vapor deposition (CVD), electroplating, surface treatments and annealing. Applied’s Advanced Packaging Development Center in Singapore houses the industry’s broadest portfolio of products that enable the foundational building blocks of heterogeneous integration, including advanced bump and micro-bump, fine-line redistribution layer (RDL), TSV and hybrid bonding.