APPLIED MATERIALS, INC.

(AMAT)
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Delayed Nasdaq  -  04:00 2022-08-05 pm EDT
109.62 USD   -1.30%
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Applied Materials aims to improve chip production for electric vehicles

09/08/2021 | 07:47am EDT
Applied Materials aims to improve chip production for electric vehicles

(Reuters) - Applied Materials on Wednesday released two new tools aimed at improving the efficiency of making a new class of chips for electric vehicles.

Applied is the world's largest maker of tools for making semiconductors. The machines announced on Wednesday are designed for chips made from a material called silicon carbide.

Such chips are gaining traction in electric vehicles like those made by Tesla Inc because they are more efficient and lighter in weight than standard silicon chips for transmitting power from a car's battery to its motors, helping improve range. Companies like Cree Inc and ON Semiconductor Corp are investing in making the chips.

Silicon carbide chips are difficult to manufacture because the material is very hard. They are bulk-manufactured on discs called "wafers" that are later sliced into individual chips. But wafers first must be polished perfectly smooth, or the resulting chips will have defects.

Because silicon carbide is so hard, chipmakers can polish only a relatively small wafer that is 150 millimeters (5.91 inches) wide without getting defects somewhere on the surface.

Applied said on Wednesday its new tool will help chipmakers polish wafers that are 200 millimeters (7.87 inches) wide. The small increase in wafer size can double the number of chips that each one can hold, helping boost output and bring down prices.

"To bring this to high volume manufacturing, you need the entire wafer surface to be identical, so you can have predictable output across the wafer," said Sundar Ramamurthy, group vice president and general manager for an Applied group working to advance chipmaking technology for automotive chips, sensors and other devices.

The other tool announced on Wednesday helps introduce a small amount of chemical impurity to wafers, which is a key step for all semiconductors to improve electricity conductivity. The process is difficult with silicon carbide because of the brittleness of the material.

Cree plans to use some of Applied's new tools, the companies said.

(Reporting by Stephen Nellis in San Francisco; Editing by Dan Grebler)

By Stephen Nellis


© Reuters 2021
Stocks mentioned in the article
ChangeLast1st jan.
APPLIED MATERIALS, INC. -1.30% 109.62 Delayed Quote.-30.34%
ON SEMICONDUCTOR CORPORATION -0.62% 67.63 Delayed Quote.-0.43%
TESLA, INC. -6.63% 864.51 Delayed Quote.-18.19%
WOLFSPEED, INC. 1.02% 89.3 Delayed Quote.-20.91%
All news about APPLIED MATERIALS, INC.
08/03Applied Materials Announces Q3 FY2022 Earnings Webcast
GL
08/01U.S. considers crackdown on memory chip makers in China
RE
07/28U.S. Congress passage of subsidies prompts chip makers to move on projects
RE
07/25Barclays Adjusts Applied Materials' Price Target to $95 from $125, Keeps Equalweight Ra..
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07/25Morgan Stanley Adjusts Applied Materials' Price Target to $115 from $133, Keeps Equalwe..
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07/21Nanexa extends collaboration agreement with Applied Materials
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07/21Nanexa AB Expands its Collaboration Agreement with Applied Materials, Inc
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07/18Deutsche Bank Adjusts Applied Materials Price Target to $110 From $135, Maintains Buy R..
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07/15Goldman Sachs Adjusts Price Target on Applied Materials to $95 From $133, Reiterates Bu..
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07/15Wells Fargo Adjusts Applied Materials' Price Target to $110 From $135, Reiterates Overw..
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Financials (USD)
Sales 2022 25 346 M - -
Net income 2022 6 548 M - -
Net Debt 2022 1 846 M - -
P/E ratio 2022 14,9x
Yield 2022 0,91%
Capitalization 95 364 M 95 364 M -
EV / Sales 2022 3,84x
EV / Sales 2023 3,51x
Nbr of Employees 27 000
Free-Float 43,0%
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Number of Analysts 30
Last Close Price 109,62 $
Average target price 133,37 $
Spread / Average Target 21,7%
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Gary E. Dickerson President, Chief Executive Officer & Director
Brice A. Hill Chief Financial Officer & Senior Vice President
Thomas J. Iannotti Chairman
Omkaram Nalamasu Chief Technology Officer & Senior Vice President
Jay O. Kerley Chief Information Officer & Senior Vice President
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