Arteris IP announced that BMW Group has licensed FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package IP for use in a chip partially funded by the German Federal Ministry of Education and Research (BMBF) as part of the ZUSE-KI-mobil publicly funded project. The goal of the project is to develop an accelerator chip for high-end deep learning applications that is a leap forward in terms of energy efficiency, reliability, robustness and security, which go far beyond current possibilities. BMW Group is serving as the coordinator and leader of the project.

Arteris FlexNoC interconnect and Resilience Package IP has been chosen because it includes critical technologies that enhance system-level functional safety, reliability, energy efficiency and security while also increasing system performance. Creating a system that balances huge bandwidth AI/ML processing requirements and tight real time latency deadlines is already difficult, and achieving stretch goals for energy efficiency, reliability and security creates another order of magnitude of challenges. Arteris IP's advanced technology was the only interconnect IP option that allowed the project to create a leap in the of automotive dedicated machine-learning SoCs.