Standard formulations in polycarbonate (PC), polyphenylene sulfide (PPS), and liquid crystal polymers (LCP) can be tailored to specific needs.
'Increased integration of electronic and mechanical functions using MIDs can meet the challenge that many industries and markets face; namely, finding simple, light weight components without compromising production efficiency and increasing cost,' said
Currently, 3D MIDs with LDS technology are widely used in antennas (consumer electronics), automotive components, medical devices, and 5G base stations. The new Edgetek formulations also can help electronic component manufacturers to miniaturize mechanical and electrical (also known as mechatronics) systems, even in high heat manufacturing processes, such as SMT (surface mount technology).
NOTE: On
ADDITIONAL INFORMATION: On pace for exponential growth, 5G technology is becoming the standard for a fully mobile and networked society through larger data capacity, faster speeds and lower latency. Sectors related to 5G, including infrastructure, will drive future applications that create high demand for 3D MID (LDS) technology and materials. For additional information, click here: Edgetek for 5G
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Barrier technologies that preserve the shelf-life and quality of food, beverages, medicine and other perishable goods through high-performance materials that require less plastic
Light-weighting solutions that replace heavier traditional materials like metal, glass and wood, which can improve fuel efficiency in all modes of transportation
Breakthrough technologies that minimize wastewater and improve the recyclability of materials and packaging across a spectrum of end uses
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