Axcelis Technologies, Inc. announced that it will showcase its Purion? and GSD Ovation? Series of ion implanters at the SEMICON Japan 2024 exhibition.

The conference and exhibition are being held December 11-13, at the Tokyo Big Sight in Tokyo, Japan. Axcelis will be in Hall 4, Booth #4621. Semiconductor manufacturers are invited to visit the Axcelis exhibit to learn first-hand about innovative ion implant solutions that deliver significant technology and manufacturing advantages: Purion Power Series?

- Featuring Axcelis' innovative solution for thin silicon, TAIKO and silicon carbide (SiC) wafer processing across the full power device applications space, and wafer handling capable for 150mm, 200mm and 300mm wafers; Purion H? Series - Offering unmatched purity and precision while achieving industry leading productivity across the full high current operating space; Purion H200? - Axcelis' state of the art single wafer high current medium energy implanter designed to address the unique implant needs for devices designed for the Internet of Things (IoT) and power applications; Purion XE? Series - The industry leading high energy implant platform with the widest energy range, including the Purion XEmax model featuring patented Boost Technology?

for the most advanced image sensor applications up to 15MeV; Purion M? Series - The lowest power consumption medium current implanter offering the broadest range of mid-current doses available, and unparalleled flexibility to meet today's evolving implant requirements; GSD Ovation? - Providing the most cost-effective way to extend high current and high energy batch platform capability by supporting emerging applications in wafer splitting (Si and SiC) and alternate substrates (lithium tantalate and ceramic).