BE Semiconductor Industries N : Agenda item 8b - Appointment of Ms Elke Eckstein as Supervisory Board member (in English/Dutch)
March 19, 2021 at 05:10 am EDT
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Agenda item 8b - Appointment of Ms Elke Eckstein as Supervisory Board member
Name:
Elke Eckstein
Date of birth (age):
14 November 1964 (56)
Current position:
CEO and President of ENICS Group Electronics
(Former) position(s) of importance in connection with the fulfillment of the supervisory board member's position:
Various senior management positions at a variety of global semiconductor, photonics and electronics firms in Germany, the United States, France and Taiwan, including Weidmüller Group, Osram AG, Global Foundries, AMD, Altis Semiconductor, Infineon AG and Siemens AG
Number of Besi shares/options:
None
Additional functions:
None
Motivation:
Ms Eckstein has extensive experience at a variety of global semiconductor, photonics and electronics firms worldwide, in various senior management positions
Agendapunt 8b - Benoeming van mevrouw Elke Eckstein als commissaris
Naam:
Elke Eckstein
Geboortedatum (leeftijd):
14 november 1964 (56)
Huidig beroep:
CEO en President van ENICS Group Electronics
(Vroegere) betrekking(en) van belang i.v.m. de vervulling van de taak als commissaris:
Diverse senior management posities bij halfgeleider-, fotonica- en elektronicabedrijven in Duitsland, de Verenigde Staten, Frankrijk en Taiwan, waaronder bij Weidmüller Group, Osram AG, Global Foundries, AMD, Altis Semiconductor, Infineon AG en Siemens AG.
Aantal aandelen/opties Besi:
Geen
Overige betrekkingen:
Geen
Motivatie:
Mevrouw Eckstein heeft uitgebreide ervaring bij verschillende halfgeleider-, fotonica- en elektronicabedrijven wereldwijd, in diverse senior management posities
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BE Semiconductor Industries NV published this content on 19 March 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 19 March 2021 09:09:06 UTC.
BE Semiconductor Industries N.V. (Besi) specializes in the design, manufacturing and marketing of semiconductor assembly equipment for the global semiconductor and electronics industries. The group develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile Internet, computer, automotive, industrial, RFID, LED and solar energy.
Net sales are distributed geographically as follows: Ireland (7.5%), Europe (8.2%), China (35.5%), Malaysia (8.4%), Korea (7.3%), Taiwan (6.5%), Thailand ( 3.6%), Asia/Pacific (11.8%), United States (8.8%) and other (2.4%).