BOE Technology Group Co. Ltd. and Qualcomm Technologies, Inc. announce their plans to establish a strategic collaboration to develop innovative display products featuring Qualcomm® 3D Sonic ultrasonic fingerprint sensors. This collaboration is expected to extend from mobile and associated 5G technologies to XR and IoT. BOE's expertise in interface devices and smart IoT systems combined with Qualcomm Technologies' broad product portfolio, makes this an ideal collaboration for the 5G era. Anticipating the signing of a collaboration agreement, both companies have started working on incorporating value-added and distinctive features to BOE's flexible OLED panels, including the Qualcomm 3D Sonic sensor. Integrating Qualcomm 3D Sonic sensors onto BOE's flexible OLED displays is intended to bring a more streamlined solution, which can enable smartphone OEMs to create unique products using the industry's thinnest and security fingerprint solution. This collaboration also results in a streamlined supply chain and reduced bill of materials (BoM) and research and development expenses. Based on the collaboration, BOE will offer integrated displays with Qualcomm 3D Sonic fingerprint sensors to its customers. Commercial devices featuring this integrated solution are expected to be available in the second half of 2020.