Daejoo Electronic Materials Co., Ltd. announced that it has received KRW 5 billion in funding from BFA Co.,Ltd., Susung Asset Management Co., Ltd., KDB Private Equity
March 30, 2016
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Daejoo Electronic Materials Co., Ltd. (KOSDAQ:A078600) announced a private placement of fourth unregistered/unsecured private convertible bonds for gross proceeds of KRW 5,000,000,000 on March 31, 2016. The bonds will mature on March 31, 2019, with lump-sum redemption of principal on maturity date for the bonds. The bonds will have a yield to maturity of 3%, and a fixed coupon rate of 1% per annum.
The bonds will be convertible into common shares of the company at a rate of 100% and at a fixed conversion price of KRW 5,190 per share from March 31, 2017 to February 28, 2019.
Daejoo Electronic Materials Co., Ltd. is a Korea-based company engaged in the manufacture of electronic materials. The Companyâs product portfolio consists of conductive materials, such as pastes for disk ceramic applications, dielectric filters, chip inductors and others, and electrode pastes for chip resistors, among others; phosphor materials, which are used for plasma display panels (PDPs), cold cathode fluorescence lamps (CCFLs) and light emitting diode (LED); polymer materials, such as insulation materials, epoxies, epoxy coating powders, semiconductor materials and others, glass materials, nano materials, metal power materials, phosphor materials, and organic LED materials. Through its subsidiary, it manufactures and distributes insulation materials and conductive pastes used for white household appliance components in China market.
Daejoo Electronic Materials Co., Ltd. announced that it has received KRW 5 billion in funding from BFA Co.,Ltd., Susung Asset Management Co., Ltd., KDB Private Equity