Dai Nippon Printing Co., Ltd. Develops Lead Frame for Miniaturized, Highly Reliable Semiconductor Package QFN (Quad Flat Non-Leaded)
October 27, 2021 at 09:00 pm EDT
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Dai Nippon Printing Co., Ltd. has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames that fix semiconductor chips and connects them externally. In addition, the new technology improves adhesiveness with a surface roughening technology of the highest industry standard that seals the copper surface to the mold compound. By providing this high definition, highly reliable lead frame aims to expand the use of semiconductor Quad Flat Non-leaded package (QFN) for vehicles. DNP has taken advantage of microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of ?25um. It has also been possible to maintain high level reliability by improving the adhesion of the mold compound and the lead frame.
Dai Nippon Printing Co. specializes in printing services. Net sales break down by activity as follows:
- printing of cards, books and business documents (54.1%): microchips, plastic cards, books, magazines, catalogs, administrative forms, brochures, indices, etc.;
- printing of flexible packages and decorative coatings (28.2%): bags, bottles, cardboard boxes, paint papers, wood and metal engraved plates, etc. The group also produces and sells optic films, ink ribbons, etc.;
- manufacturing of electronic components (13.7%): semiconductors components, photolithography masks, projection screens, protection filters for screens, color printers components, etc.;
- production of beverages (4%).
Net sales are distributed geographically as follows: Japan (83%), Asia (10.6%) and other (5.4%).
DAI NIPPON PRINTING CO., LTD. 
