FATC's Board of Directors resolved the Compensation
Committee Members
Date of events
2022/06/24
To which item it meets
paragraph 6
Statement
1.Date of occurrence of the change:2022/06/24
2.Name of the functional committees: Compensation Committee
3.Name of the previous position holder: Cheng Yu, and Shen Hui Ya, and
Chuang Hsiao Chen
4.Resume of the previous position holder:
(1)Cheng Yu:Independent Director of Formosa Advanced Technologies
Corporation and Formosa Petrochemical Corporation. Chairman of
Mirror TV Broadcasting Ltd.
(2)Shen Hui Ya:Independent Director of Formosa Advanced Technologies
Corporation. Member of Compensation Committee, China Airlines Co., Ltd.
(3)Chuang Hsiao Chen:Independent Director of Formosa advanced Technologies
Corporation and Interactive Digital Technologies Inc.
5.Name of the new position holder: Cheng Yu, and Shen Hui Ya,
and Chuang Hsiao Chen
6.Resume of the new position holder:
(1)Cheng Yu:Independent Director of Formosa Advanced Technologies
Corporation and Formosa Petrochemical Corporation. Chairman of
Mirror TV Broadcasting Ltd.
(2)Shen Hui Ya:Independent Director of Formosa Advanced Technologies
Corporation. Member of Compensation Committee, China Airlines Co., Ltd.
(3)Chuang Hsiao Chen:Independent Director of Formosa advanced Technologies
Corporation and Interactive Digital Technologies Inc.
7.Circumstances of change (Please enter "resignation", "dismissal",
"term expired", "death" or "new appointment"):term expired
8.Reason for the change: term expired
9.Original term (from __________ to __________):2019/06/20~2022/06/19
10.Effective date of the new member:2022/06/24
11.Any other matters that need to be specified:None
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Formosa Advanced Technologies Co. Ltd. published this content on 24 June 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 24 June 2022 11:45:02 UTC.
Formosa Advanced Technologies Co., Ltd. is a Taiwan-based company principally engaged in the provision of integrated circuit (IC) assembly and related testing services and module services. The Company provides services applied in thin small outline packages (TSOPs), small outline packages (SOPs), quad flat packages (QFPs), thin quad flat packages (TQFPs), ball grid array (BGA) packages, chip probing (CP) testing, solid state disk (SSD) testing, system-in-package (SIP) testing, embedded multimedia card (eMMC) testing, as well as cutting, grinding and testing of light emitting diodes (LED) wafers, among others. The Company operates its businesses principally in Taiwan, Hong Kong and South Korea.
FORMOSA ADVANCED TECHNOLOGIES CO., LTD. 
