Rockchip Releases AIoT Solution RK1808 with Built-In High Performance NPU at CES2019
January 08, 2019 at 12:00 pm EST
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Rockchip released the RK1808, an AIoT solution with built-in high performance NPU. In terms of hardware specifications, Rockchip RK1808 AIoT solution features: Dual-core Cortex-A35 CPU architecture, NPU computing performance up to 3.0TOPs, VPU supporting 1080P video codec, microphone array with hardware VAD function and camera video signal input with built-in ISP, AIoT is an inevitable trend of the IoT development and also an chance for intelligent upgrades of traditional industries. The four dominant features about functional modules and rich interfaces of Rockchip RK1808 will efficiently energize the AIoT eco-chain and meet developers’ needs to integrate technology into real-life applications. Ultimate low power consumption, Powerful AI computing and easy to develop. Rockchip RK1808 solution is designed for various AI applications including security, education, automobile, smart wearable devices, home appliances, storage and so on, with a series of functions such as voice wake-up, speech recognition, face detection and attribute analysis, face recognition, posture analysis, target detection and recognition, image processing, etc. RK1808 can not only power technology upgrades and breakthrough for the AIoT eco-chain, but can also help eco-chain partners to explore the AIoT market.
Rockchip Electronics Co Ltd, formerly Fuzhou Rockchip Electronics Co Ltd is a China-based company mainly engaged in the design, development and sales of large-scale integrated circuits and application solutions. The Company provides customers with chip-related products and technical services. The Company's main products include intelligent application processor chips, power management chips, other chips, and combination devices related to self-developed chips. The Company distributes its products in domestic market and to overseas markets. The Company's products are used in multiple fields such as intelligent IoT, consumer electronics, automotive electronics, mobile phone communications, and artificial intelligence.