Xiamen Silan Ming Gallium Compound Semiconductor Co., Ltd. announced that it expects to receive CNY 300 million in funding from Xiamen Semiconductor Investment Group Co., Ltd., Hangzhou Silan Microelectronics Co., Ltd
November 28, 2021
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Xiamen Silan Ming Gallium Compound Semiconductor Co., Ltd. announced that it will receive CNY 300,000,000 in an equity round of funding on November 29, 2021. The transaction will include participation from existing investors, Xiamen Semiconductor Investment Group Co., Ltd. which will continue to hold 70% stake by investing CNY 210,000,000 and Hangzhou Silan Microelectronics Co., Ltd which will continue to hold 30% stake by investing CNY 90,000,000. After the capital increase, registered capital of the company will grow from CNY 970,370,000 to CNY 1,270,370,000. The transaction was approved by the 29th meeting of the seventh board of directors of Hangzhou Silan Microelectronics Co., Ltd. and is subject to approval of its shareholders. The company intends to sign an agreement with the investors.
On December 15, 2021, the transaction has been approved at the the third extraordinary general meeting of shareholders in 2021 of Hangzhou Silan Microelectronics Co., Ltd
Hangzhou Silan Microelectronics Co., Ltd. is a China-based company principally engaged in the design, manufacture and sales of electronic components. The Company is also engaged in the importing and exporting of mechanical and electrical products. The Company's main products include integrated circuits, semiconductor discrete devices and light-emitting diode (LED) products. The Company mainly operates its businesses in Zhejiang Province, China.
Xiamen Silan Ming Gallium Compound Semiconductor Co., Ltd. announced that it expects to receive CNY 300 million in funding from Xiamen Semiconductor Investment Group Co., Ltd., Hangzhou Silan Microelectronics Co., Ltd