On the 22nd, ahead of the semiconductor supercycle, HANMI Semiconductor released Vision Placement 8.0 flagship equipment. HANMI Semiconductor's Vision Placement is the top equipment with about 80% of global market share.

Vision Placement 8.0 incorporates strip cutting, cleaning, inspection, and classification processes. It was released to meet demands for cutting of 'WLP' (Wafer Level Package), 'PLP' (Panel Level Package) and Ultra- precision 'PCB' (Printed Circuit Board) panels in markets.

It also installed 'OHT' (Over Head Transport) for automation of semiconductor production lines. This equipment is the most expensive vision placement equipment that has been released.

Kim Min-hyun, president of Hanmi Semiconductor, said. 'Vision Placement 8.0 is a model that has been introduced in collaboration with global semiconductor manufacturers for a long time and it is the fruit of HANMI Semiconductor technology that pioneered a new area called Vision Placement.'

'As demand for semiconductors is expected to increase significantly in various fields such as artificial intelligence, smart cars, data centers, and 5G, it is expected that sales of vision placement will also increase.'

'HANMI Semiconductor has a high proportion of sales in overseas markets where demand for non- memory semiconductor (system semiconductor) equipment is high. In the 10 years from 2010 to last year, the average proportion of exports to sales was more than 77%.'

'Sales of 'EMI Shield' and 'Flip Chip Bonder' are also showing positive performance this year due to strengthening non- face-to-face and increased investment in 5G. Through this, it is expected to surpass sales of 217.1 billion won in 2018 as its biggest-ever performance.'

According to the SEMI, the size of the semiconductor equipment market, which is $68.9 billion this year, will increase to $71.9 billion next year and $76.1 billion in 2022. An official from HANMI Semiconductor said, 'We will be able to surpass this year's performance thanks to the semiconductor supercycle next year.'

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HANMI Semiconductor Co. Ltd. published this content on 22 December 2020 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 22 December 2020 03:18:05 UTC