Henkel announced the commercialization of a high-performance non-conductive die attach film (ncDAF) engineered to address the demands of contemporary packaging device designs. Loctite Ablestik ATB 125GR is a high-reliability ncDAF suitable for wirebond laminate and lead frame packages, compatible with small- to medium-sized die, and formulated to provide excellent workability and processability. As 3D packaging miniaturization accelerates across the microelectronics market, smaller, thinner, high-density package structures are the norm.

For these reasons, many packaging specialists opt for die attach film materials instead of pastes to enable more challenging dimensions. Compared to pastes, die attach films offer controlled thickness and flow, no resin bleed, consistent fillet formation and bond line stability before and after cure. Loctite Ablestik ATB 125GR provides these proven advantages in addition to high-reliability, Automotive Grade 0 performance for both laminate and lead frame designs, making it a good candidate for demanding applications across consumer, automotive and industrial.

Among the unique attributes of Loctite Ablestik ATB 125GR are its low modulus and low coefficient of thermal expansion (CTE) properties at room temperature, with a high modulus at wire bonding temperature to ensure high-reliability performance. The material has demonstrated strong adhesion on Ag, Cu and PPF metal lead frames and laminate substrates, has low ionics to facilitate Cu wire bonding, and provides excellent processability and workability for all processing steps (lamination, dicing and die pick-up) on dies ranging in size from 0.5 mm x 0.5 mm to 3.0 mm x 3.0 mm. Loctite Ablestik ATB 125GR is currently available in a 25 µm thickness, with custom thicknesses available on request.