Various process advantages
Technomelt Low Pressure Molding (LPM) technology was invented some 30 years ago by
The technology is particularly adept at encapsulating discrete areas in complicated assembly where wiring is attached to a printed circuit board (PCB), PCBAs and other rigid component. One reason for this is that Technomelt resins, which are all unfilled, are resistant to high stresses and at the same time very flexible.
The encapsulating material provides exceptional electrical insulation, as well as resistance to a broad range of chemicals, extreme thermal cycling across high and low temperatures, and vibrations. The internal electronics are fully protected against outside elements, including ingress of water and dust, and long-term UV exposure.
High sustainability
Henkel Technomelt polyamide resins are compliant with the European RoHS (Restriction of Hazardous Substances) Directive and REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) regulations. 'An additional important environmental feature of these polyamides, and one that is increasingly appreciated, is that they are largely bio-based, with up to around 80% of their content coming from renewable vegetable sources,' Otto adds.
Efficient use of material
An advantage of Technomelt Low Pressure Molding over traditional potting systems is that it is much more economical in the amount of material it uses in the finished part. In potting operations, the normal approach is to build a box around the component to be encapsulated, and then fill the box until the component is covered. With Technomelt Low Pressure Molding, the component is placed into a mold that has a cavity geometry similar to that of the component, so that when the polyamide is injected, it forms a skin around the component that is more or less the same thickness at all points. This means that the amount of encapsulating material used per shot can be considerably less.
Costs of mold production are relatively low, especially as they are often made out of aluminum, which is much less expensive than tools made out of steel used in high-pressure injection molding. In recent years, even more cost-effective additive manufacturing (also known as 3D printing) techniques have also been adopted to make the molds.
Providing value to various markets
The need for efficient low pressure encapsulation of electronics has never been as great as it is today. The Internet of Things (IOT) and Industrial Internet of Things (IIOT) depends on a foundation of sensors and associated electronic connections and components to support all sorts of devices in the home, at work, and on the move. This trend has also lead to increased network connectivity demands for data and power cables and connectors that function in the harshest environments. In the world of healthcare, patient diagnostics and sensing in real time require new electronic devices like wearable devices that are used in and outside of controlled medical environments. Technomelt Low Pressure Molding responds to all of these trends.
For certain types of medical applications, Technomelt can also be used in applications that go beyond encapsulation of electronics. For example, it is suitable for attaching flexible tubing in liquid delivery systems, since it does not distort the tubing and provides a permanent, leakproof junction.
Partnerships with equipment suppliers
In collaboration with partners producing processing equipment around the world,
Additionally, Otto highlights 'there are many developments pushing up requirements for high-quality, low-cost component encapsulation. We at
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Battery sensor circuit board before and after low pressure molding process. Electronic parts get protected against moisture, chemical exposure and high temperature.
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Battery sensor circuit board before and after low pressure molding process. Electronic parts get protected against moisture, chemical exposure and high temperature.
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Low pressure molding process: The bare electronics are inserted into a predesigned mold set. TECHNOMELT encapsulates electronics at low pressure. After molding, parts get tested and moved to final assembly.
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Low pressure molding process: The bare electronics are inserted into a predesigned mold set. TECHNOMELT encapsulates electronics at low pressure. After molding, parts get tested and moved to final assembly.
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Battery sensor circuit board before and after low pressure molding process. Electronic parts get protected against moisture, chemical exposure and high temperature.
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Battery sensor circuit board before and after low pressure molding process. Electronic parts get protected against moisture, chemical exposure and high temperature.
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Low pressure molding process: The bare electronics are inserted into a predesigned mold set. TECHNOMELT encapsulates electronics at low pressure. After molding, parts get tested and moved to final assembly.
Open Image in Lightbox
Low pressure molding process: The bare electronics are inserted into a predesigned mold set. TECHNOMELT encapsulates electronics at low pressure. After molding, parts get tested and moved to final assembly.
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Sebastian Hinz Henkel Adhesive Technologies Media Relations Headquarters,
+49-211-797-8594
press@henkel.com
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