Inspur Electronic Information Industry Co., Ltd. is championing the ?Open Possibilities? theme of the 2021 OCP Global Summit, by empowering small- and medium-sized enterprises through hyperscale-type technologies, originally designed only for the larger data centers, and providing a path to open compute infrastructure. During the two-day event, the company will showcase its NF5180M6 and NF5280M6 General Purpose Enterprise Servers, powered by 3rd Generation Intel? Xeon? Scalable processors, to meet the needs of businesses in all industries for open standards at-scale servers in an enterprise level 1U/2U box. The flexible, high-performance and energy efficient servers are being deployed for virtualization, driving large business applications, running transactional databases and more. The company?s new 1OU OCP design will also be demonstrated at the event, which combines the best of ODCC and OCP building blocks to create a reliable mainstream design that can be offered as an alternative to the Facebook design. Inspur Information has been involved in the three major open computing organization ? OCP, Open Data Center Committee (ODCC) and Open 19 ? demonstrating the company?s commitment to taking the lead in advancing the commercialization of open technology. Collaborating with OCP community partners is important to accelerate open compute adoption. Inspur Information is proud to launch, jointly with Samsung, the Poseidon V2 E3.x reference system which adopted composable architecture to maximize the benefits of EDSFF E3.x form factor. Poseidon V2 system can accommodate not only the PCIe Gen5 SSDs but also various devices like AI/ML accelerators or CXL Memory Expanders. Data center users can configure the system according to application's needs. In addition, the company continues to invest in the leading AI and HPC use case by OAI design, working with a major cloud service provider to provide input on the architecture. The OAI specification?led by Facebook and Intel in the OCP community?unifies the technical specifications of the accelerator module and simplifies the design complexity of the AI accelerator system, thereby shortening time to market for the hardware system.