Intel Breaks Ground on Two New Chip Factories in Arizona
September 24, 2021 at 03:21 pm EDT
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Intel broke ground on two new chip factories at the company’s Ocotillo campus in Chandler, Arizona. In a ceremony attended by senior government officials and community leaders, Intel CEO Pat Gelsinger celebrated the start of construction on the private investment in state history and reiterated the company’s commitment to investing in U.S. semiconductor leadership. Advanced domestic chipmaking capacity and capabilities are critical for the sake of both economic and national security. The United States has lost ground in semiconductor manufacturing and is at risk of falling farther behind. With its new IDM 2.0 strategy, Intel is doing its part to help rebuild U.S. leadership and bring more balance to the global supply chain. Intel is the only semiconductor manufacturer with process and packaging research capabilities in the United States, and the company is investing in domestic capacity to support the surging worldwide demand for chips across multiple segments, from PCs to automobiles to the data center and more. With the addition of the two new factories – to be named Fab 52 and Fab 62 – Intel’s Ocotillo campus will house a total of six fabs. The new investment will create more than 3,000 high-tech, high-wage Intel jobs, 3,000 construction jobs, and support an estimated 15,000 additional indirect jobs in the local community. When fully operational in 2024, the new fabs will manufacture Intel’s most advanced process technologies, including Intel 20A featuring the new RibbonFET and PowerVia innovations.
Intel Corporation is the world leading manufacturer of semiconductor. Net sales break down by family of products and services as follows:
- computing architectures products (93.2%): processors and microprocessors (Pentium, Intel Xeon brands, etc.), graphics cards, chips and motherboards, connectivity products, cellular modems, Ethernet controllers, network components, storage products, etc. for PCs, servers, data centers, cloud networks, workstations, notebooks, Internet of Things, graphics architectures, intelligent peripherals and communications infrastructures. The group also develops associated software;
- advanced driving assistance and autonomous driving systems (3.8%; Mobileye);
- wafer manufacturing services (1.8%): accelerators, monolithic chips, silicon wafers, etc. The group also offers chiplet software and mask manufacturing equipment for advanced lithography;
- other (1.2%).
Net sales (including intragroup) are distributed geographically as follows: the United States (25.7%), China (27.4%), Singapore (15.9%), Taiwan (12.7%) and other (18.3%).
INTEL CORPORATION 
